WMSIC Electronic Components

Infineon BSP613PH6327XTSA1

ModelBSP613PH6327XTSA1
PackageSOT-223
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

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Technical data

Product details

20 specifications

Core information

Product name
Infineon BSP613PH6327XTSA1
Type
INFINEON
Unit
Electronic Component
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
BSP613PH6327XTSA1
Electronic Component
1
Package
SOT-223
Electronic Component
MOSFET
Electronic Component
SIPMOS®
Electronic Component
0g
Electronic Component
Infineon Technologies
Electronic Component
1
FET Type
P
Electronic Component
BM0265558190
Type
Surface Mount
Operating Temperature
55°C ~ 150°C(TJ)
Electronic Component
Active

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSP613PH6327XTSA1 产品概述

BSP613PH6327XTSA1是英飞凌(Infineon)SIPMOS®系列中的一款P沟道金属氧化物半导体场效应晶体管(MOSFET),为有源状态的表面贴装器件,广泛适配汽车及工业领域的多种应用需求,兼具高可靠性与性能优势。

一、核心身份与基础定位

该器件由英飞凌技术(Infineon Technologies)设计制造,属于SIPMOS®小信号MOSFET系列,采用卷带(TR)包装,便于自动化批量生产与存储。其安装类型为表面贴装型,供应商器件封装为PG-SOT223-4,外壳规格为TO-261-4(TO-261AA),体积紧凑,适合高密度电路设计。

二、关键电气参数深度解析

1. 电压与阈值特性

  • 漏源电压(Vdss):最大60V,可覆盖多数中低压应用场景;
  • 栅源电压范围(Vgs):最大值±20V,兼容3.3V、5V、10V等多种驱动电路,避免过压损坏;
  • 阈值电压(Vgs(th)):最大值4V(测试条件:Id=1mA),确保低驱动电压下即可稳定导通,降低驱动电路设计难度。

2. 电流与导通损耗

  • 连续漏极电流(Id):25℃环境温度下为2.9A,满足中小功率负载驱动需求;
  • 导通电阻(Rds(on)):最大值130毫欧(测试条件:Id=2.9A,Vgs=10V),低导通电阻可显著减少功率损耗与发热,提升系统效率。

3. 功率与温度特性

  • 最大功耗:1.8W(环境温度Ta下),支持短时间过载工况;
  • 工作温度范围:结温(TJ)覆盖-55℃至150℃,满足汽车(发动机舱高温、低温启动)、工业(户外设备)等恶劣环境的温度要求。

4. 电容与开关特性

  • 输入电容(Ciss):最大值875pF(测试条件:Vds=25V),反映器件输入阻抗特性;
  • 栅极电荷(Qg):最大值33nC(测试条件:Vgs=10V),低栅极电荷可降低开关损耗,提升动态响应速度。

三、封装与可靠性设计

该器件采用SOT-223封装(PG-SOT223-4),属于小体积表面贴装封装,引脚间距合理,便于自动化贴装与焊接,同时有效控制电路板空间。英飞凌针对汽车及工业级应用的可靠性要求,对该器件进行严格质量管控,符合行业最高标准,可长期稳定工作于严苛环境中。

四、典型应用场景

BSP613PH6327XTSA1的性能特性使其适配多种场景:

  1. LED照明:低导通损耗减少驱动电路发热,宽温度范围满足户外LED灯具高低温需求;
  2. ADAS(高级驾驶辅助系统):汽车级可靠性支持雷达、摄像头等模块的信号控制与负载驱动;
  3. 车身控制单元(BCU):用于车窗、门锁、灯光等小负载的开关控制,响应快速稳定;
  4. 开关电源(SMPS):作为同步整流或控制管,提升电源转换效率;
  5. 小功率电机控制:驱动小型直流电机(座椅调节、后视镜),低损耗降低电机发热。

五、核心性能优势总结

  1. 低损耗高效:130mΩ导通电阻显著降低功率损耗,提升系统能效;
  2. 宽电压兼容:±20V栅源电压范围适配多种驱动电路,设计灵活;
  3. 宽温可靠:-55℃~150℃结温范围,满足汽车/工业恶劣环境需求;
  4. 紧凑设计:SOT-223封装节省电路板空间,适合高密度布局;
  5. 高可靠性:英飞凌汽车级/工业级品质,长期稳定工作。

综上,BSP613PH6327XTSA1是一款针对汽车与工业领域优化的高性能P沟道MOSFET,平衡了性能、可靠性与体积,是多种中低压、中小功率应用的理想选择。

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