WMSIC Electronic Components

Infineon BSZ110N06NS3GATMA1

ModelBSZ110N06NS3GATMA1
PackageTSDSON-8FL
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon BSZ110N06NS3GATMA1
Type
INFINEON
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
BSZ110N06NS3GATMA1
Electronic Component
1
Package
TSDSON-8FL
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.07g
Electronic Component
1
Electronic Component
BM0209565253
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
50W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSZ110N06NS3GATMA1 产品概述

一、概述

BSZ110N06NS3GATMA1 是英飞凌(Infineon)的一款 60V 级 N 沟道功率 MOSFET,面向中高电流开关应用。器件在 VGS=10V 时具有极低的导通电阻(RDS(on)=11mΩ),同时具备较大的输入电容与输出电容,适用于对导通损耗和开关特性有综合要求的场合。器件工作温度范围宽(-55℃ ~ +150℃),单片封装为 TSDSON-8FL,利于高密度 PCB 设计与热管理。

二、主要参数(依据给定基础参数)

  • 类型:N 沟道 MOSFET,数量:1 个
  • 漏源电压 Vdss:60 V
  • 连续漏极电流 Id:53 A
  • 导通电阻 RDS(on):11 mΩ @ VGS=10 V
  • 阈值电压 Vgs(th):4 V @ ID=23 µA
  • 总栅极电荷 Qg:33 nC (0 → 10 V)
  • 输入电容 Ciss:2.7 nF;输出电容 Coss:590 pF;反向传输电容 Crss:17 pF
  • 功耗 Pd:50 W
  • 工作温度:-55 ℃ ~ +150 ℃
  • 封装:TSDSON-8FL(薄小型低感封装)

三、特点与优势

  • 低导通电阻(11 mΩ @10V)可显著降低导通损耗,适合高效率电源与低损耗开关场景。
  • 较高的连续电流承载能力(53 A)满足大电流瞬态与稳态需求。
  • 较大的输入电容和栅极电荷(Qg=33 nC)在提高开关速度的同时需配合合适的驱动器以保证开关损耗可控。
  • TSDSON-8FL 封装兼顾体积与散热,适用于空间受限且需低寄生电感的应用。

四、应用场景

  • 同步整流器、降压(buck)及升降压(buck-boost)开关电源
  • 电机驱动前级、负载开关与高频开关模块
  • 汽车电子(根据具体认证与环境规范)、通信电源与消费电子供电管理

五、设计与使用建议

  • 栅极驱动:QG=33 nC 表明需要较强的驱动能力以实现快速切换,建议选用能提供足够峰值电流的门极驱动器,并在驱动回路中加合适的阻尼(Gate resistor)以抑制振铃。
  • PCB 布局:宽短的电源回路、靠近封装的退热平面与多孔过孔散热(thermal vias)可降低结-壳热阻与寄生电感,减小开关损耗与 EMI。
  • 热管理与散热:尽管器件 Pd=50 W,但实际散热受 PCB、封装和环境影响大,需按照实际工况计算结温并进行必要的散热设计与热降额。
  • 开关折衷:在高频应用中注意导通损耗与开关损耗的权衡;若工作在低侧开关或同步整流场合,可利用低 RDS(on) 优化效率。
  • 可靠性检验:在关键应用中,请参考英飞凌完整数据手册获取 SOA、脉冲极限、热特性与封装机械规范,并进行必要的热循环与电应力验证。

如需更详细的电气特性曲线、热阻与封装引脚图或参考电路,请告知,我可基于原厂数据表为您补充关键图表与设计示例。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.