Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Infineon BSZ096N10LS5ATMA1
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Infineon BSZ096N10LS5ATMA1
- Type
- INFINEON
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- INFINEON
- Electronic Component
- BSZ096N10LS5ATMA1
- Electronic Component
- 1
- Package
- TSDSON-8
- Electronic Component
- MOSFET
- Electronic Component
- MOSFET
- Electronic Component
- OptiMOS™ 5
- Electronic Component
- 0g
- Electronic Component
- Infineon Technologies
- Electronic Component
- 1
- FET
- Electronic Component
- FET Type
- N
- Electronic Component
- BM0227677860
- Type
- Surface Mount
- Operating Temperature
- 55°C ~ 150°C（TJ）
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSZ096N10LS5ATMA1 — Infineon OptiMOS™ 5 N沟场效应管产品概述
一、产品简介
BSZ096N10LS5ATMA1 是英飞凌 OptiMOS™ 5 系列的一款 N 沟功率 MOSFET，采用低阻抗、低开关损耗设计，适用于需要高效率和高密度封装的电源管理场景。器件封装为 TSDSON-8（供应商封装 PG-TSDSON-8-FL），为卷带（TR）贴片交付，器件状态为有源。
二、主要电气参数
- 漏源电压 Vdss：100 V
- 连续漏极电流 Id（Tc）：40 A
- 最大功耗 Pd（Tc）：69 W
- 最大栅压 Vgs：±20 V；栅阈值 Vgs(th) ≤ 2.3 V（@ 36 µA）
- 在 Vgs=10 V、Id=20 A 时导通电阻 Rds(on)（最大）：9.6 mΩ
- 输入电容 Ciss（最大）：2100 pF（@ Vds=50 V）
- 栅极电荷 Qg（最大）：22 nC（@ Vgs=10 V）
- 工作结温：-55 °C ~ 150 °C（TJ）
三、性能亮点
- 低导通电阻带来较低的导通损耗，适合中高电流路径使用。
- 适度的栅极电荷和较大的输入电容在开关速度与驱动能耗之间取得平衡，有利于升降压转换器和同步整流器的效率优化。
- 紧凑的 TSDSON 封装利于热性能与 PCB 布局在高密度设计中的协调。
四、典型应用场景
- 同步整流和开关电源（SMPS）输出级、DC–DC 降压/升压转换器
- 服务器、通信设备和消费电子的电源管理模块
- 电机驱动与工业电源系统（在合适热设计下）
五、封装与选型提示
该器件为表面贴装 TSDSON-8（PowerTDFN 8），适合回流焊工艺。设计时应关注散热路径（基板热过孔和铜箔面积）以发挥额定 40 A 和 69 W（Tc）能力；驱动电压建议在 10 V 水平以获得标称低 Rds(on)，注意不要超过 ±20 V 的栅压限制。
如需更详细的参数曲线与封装机械图，请参考英飞凌官方器件数据手册以完成最终电路设计与热仿真验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
