WMSIC Electronic Components

Infineon TLE4251D

ModelTLE4251D
PackageTO-252-4
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon TLE4251D
Type
INFINEON
Minimum package
2500 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
280mV@(300mA)
Electronic Component
INFINEON
Electronic Component
TLE4251D
Electronic Component
1
Package
TO-252-4
Electronic Component
Linear Regulator(LDO)
Electronic Component
1g
Electronic Component
1
Features
Voltage
Electronic Component
BM0229304818
Operating Temperature
40℃~+150℃@(Tj)
Operating Voltage
40V
Output
Electronic Component
Output Voltage
2.5V~40V
Output Current
400mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TLE4251D 线性可调稳压器产品概述

一、主要参数概览

  • 型号:TLE4251D(Infineon 英飞凌)
  • 输出类型:可调(线性稳压器 LDO)
  • 工作/输入电压:最高 40V
  • 输出电压范围:2.5V ~ 40V(可调)
  • 输出电流:最大 400mA
  • 压差(Dropout):280mV @ 300mA
  • 静态电流 Iq:2μA(典型)
  • 电源纹波抑制比 PSRR:60dB @ 100Hz
  • 特性:带使能(EN);过热保护;过流保护;短路保护
  • 输出极性:正极
  • 输出通道数:1
  • 工作结温范围:-40℃ ~ +150℃(Tj)
  • 封装:TO-252-4(DPAK 型式,四引脚)

二、主要特性说明

TLE4251D 是针对中等电流应用设计的低压差线性稳压器,具有极低静态电流(仅 2μA),适合对待机功耗敏感的系统。低压差 280mV(在 300mA 时)允许在输入电压接近输出电压时仍保持稳压。60dB@100Hz 的 PSRR 表明对工频及低频纹波具有良好抑制能力,适合噪声要求较高的模拟或供电前端。

三、功能与保护

  • 使能(EN):提供外部开关控制,便于系统电源管理。EN 高电平使能,EN 低电平关闭(具体阈值请参见数据手册)。
  • 过流/限流保护:在短路或过载情况下自动限制输出电流,保护器件与负载。
  • 过热保护:当结温过高时进入热关断以保护芯片,冷却后自动恢复。
    这些保护机制配合低静态电流设计,可提高整体系统可靠性并降低待机能耗。

四、封装与引脚(TO-252-4)

TO-252-4(DPAK)适合表面贴装与良好 PCB 散热设计。标准引脚安排包含输入、输出、调整(或地)、使能等功能脚。实际引脚定义、外形尺寸和推荐 PCB 敷铜请以官方数据手册为准。

五、外部元件与典型连接建议

  • 输出电压通过外接分压电阻 R1、R2 调整:Vout = Vref × (1 + R2/R1)。参考电压 Vref 及建议电阻范围请参见原厂资料。
  • 输入:建议在输入端并联高频去耦电容(例如 1μF~10μF 陶瓷)以抑制瞬态与导线感应。
  • 输出:为保证稳定性与瞬态性能,推荐使用低 ESR 输出电容(例如 4.7μF~10μF 或按数据手册指定)。不同电容值与 ESR 会影响环路稳定性,实际设计时务必按数据手册的稳定性条件选择电容。
  • 布局:输入输出电容应尽量靠近器件引脚布置,地线使用低阻抗回流路径,减少寄生阻抗和噪声耦合。

六、热设计与功率计算

线性器件的功耗主要由 (Vin - Vout) × Iout 决定。举例:若 Vin=12V,Vout=5V,Iout=300mA,则 Pdiss = (12-5)×0.3 = 2.1W。
需按实际 PCB 散热条件查阅器件的热阻 RθJA 或 RθJC,并计算结温:Tj = Ta + Pdiss × RθJA,确保 Tj < 150℃(最大允许结温)。在高功耗情况下,增加 PCB 铜箔面积或采用散热板以降低结温。

七、典型应用场景

  • 电池供电或便携设备(需低静态电流与可调电压)
  • 汽车与工业系统的局部稳压(输入耐压高达 40V,适合 12V/24V 环境)
  • 模拟前端、传感器供电、微控制器轨供(需低噪声与高 PSRR)
  • 低功耗待机电路(利用 2μA 静态电流降低待机消耗)

八、选型与使用注意事项

  • 在高输入电压或高输出电流条件下务必进行热评估与 PCB 散热设计。
  • 输出稳定性高度依赖外部电容与 ESR,严格遵循数据手册推荐的电容类型和最小值。
  • 检查使能阈值、参考电压及精度、温漂等关键参数以满足系统要求。
  • 如需精确噪声/瞬态性能或在严苛环境下工作,请参考英飞凌官方数据手册与应用笔记获取详尽设计指导。

如需我为您的具体电压/电流工况做功耗与热设计计算、或给出典型的外部元件数值及 PCB 布局建议,请提供输入电压、目标输出电压、最大负载电流与 PCB 可用散热面积等信息。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.