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Infineon BSC150N03LDGATMA1
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Infineon BSC150N03LDGATMA1
- Type
- INFINEON
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- INFINEON
- Electronic Component
- BSC150N03LDGATMA1
- Electronic Component
- 1
- Package
- TDSON-8
- Electronic Component
- 2 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.44g
- Electronic Component
- 1
- Electronic Component
- BM0058432628
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 26W
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
- Voltage(Vdss)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSC150N03LDGATMA1 产品概述
一、概述
BSC150N03LDGATMA1 是英飞凌（Infineon）推出的一款双通道 N 沟道功率 MOSFET，采用 TDSON-8 封装。器件面向中低压、高效率开关应用，提供低导通电阻与较低的寄生电容，适合开关转换、同步整流和功率管理等场合。器件工作温度范围宽（-55℃ ~ +150℃），适用于严苛环境与工业级产品设计。
二、主要参数
- 漏源峰值电压（Vdss）：30 V
- 通道数量：2 个 N 沟道
- 导通电阻（RDS(on)）：15 mΩ @ VGS = 10 V
- 连续漏极电流（Id）：20 A（额定条件）
- 耗散功率（Pd）：26 W
- 栅极阈值电压（VGS(th)）：2.2 V @ 250 µA
- 总栅极电荷（Qg）：13.2 nC @ 10 V
- 输入电容（Ciss）：1.1 nF
- 输出电容（Coss）：470 pF
- 反向传输电容（Crss / Crss）：16 pF
- 工作温度：-55℃ ~ +150℃
- 封装：TDSON-8
三、电气与开关特性说明
器件在 VGS = 10 V 时可达到 15 mΩ 的低 RDS(on)，适合在有充分栅极驱动的系统中作为低损耗开关使用。Qg 为 13.2 nC，提示在高频开关应用中栅极驱动能量与开关损耗需被考虑；Ciss（1.1 nF）与 Coss（470 pF）反映开关时的电荷分布与回灌行为，Crss（16 pF）决定米勒效应对开关过渡的影响。
四、热性能与封装优势
TDSON-8 封装提供较小的封装尺寸与良好的导热路径，适合对 PCB 散热设计有要求的应用。额定功耗 26 W 在良好散热条件（焊盘/散热通孔或散热片）下可发挥最大性能。设计时应确保底部散热焊盘足够，最小化 PCB 温升以保持器件可靠性。
五、典型应用场景
- 同步整流与降压 DC-DC 转换器
- 电源管理与负载开关
- 电机驱动与桥式拓扑（双通道便于半桥设计）
- 汽车与工业电源模块（考虑宽温度与高可靠性）
六、设计与布局建议
- 栅极驱动：为获得最低 RDS(on)，建议提供 VGS = 10 V 的驱动电压，必要时在栅极串联小电阻以抑制振铃。
- 开关损耗：考虑 Qg 与 Coss，计算驱动能量与开关损耗，必要时采用缓冲/死区时间优化。
- PCB 布局：保证大面积散热焊盘、缩短电流回路、在开关节点处使用适当的旁路电容，减小寄生电感。
- 热保护：在高功率工作点建议布局热测点或温度保护策略，确保长期可靠性。
七、总结
BSC150N03LDGATMA1 以其 30 V 额定电压、低 RDS(on) 与双通道 TDSON-8 封装，适合要求体积小、效率高且需双通道配合的电源与驱动应用。设计时需权衡栅极驱动能力、开关频率与 PCB 散热，以发挥器件最佳性能。
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