WMSIC Electronic Components

Infineon IR21834SPBF

ModelIR21834SPBF
PackageSOIC-14
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon IR21834SPBF
Type
INFINEON
Unit
Electronic Component
Minimum package
1980 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
IR21834SPBF
Electronic Component
1
Package
SOIC-14
Electronic Component
(UVP)
Electronic Component
Gate Driver IC
Electronic Component
0.4g
Electronic Component
1
Electronic Component
BM0058404650
Operating Temperature
40℃~+150℃
Operating Voltage
10V~20V
Load Type
IGBT;MOSFET
Driver
Electronic Component
Current(IOH)
1.4A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IR21834SPBF 产品概述

一、核心特性

IR21834SPBF 是一款适用于半桥拓扑的高/低侧门极驱动器,面向 MOSFET 与 IGBT 驱动应用。器件为双通道(半桥)驱动,采用 SOIC-14 封装,工作结温范围宽 (-40℃ ~ +150℃ @ Tj),适合工业级高可靠性场合。典型驱动电源范围 VCC = 10V ~ 20V,具备较强的电流驱动能力:拉电流 IOH ≈ 1.4A,灌电流 IOL ≈ 1.8A,典型上升时间 tr ≈ 40ns,下降时间 tf ≈ 20ns,能满足快速开关器件的门极充放电需要。

二、主要功能点

  • 高/低侧独立驱动,支持浮动高侧驱动模式(bootstrap 供电常用);
  • 与 MOSFET/IGBT 兼容的驱动电平和电流能力,适合开关频率较高的功率转换应用;
  • 宽温度工作能力,适用于严苛环境;
  • 常见保护与可靠性设计(例如欠压锁定 UVLO、电平容错设计等为同类器件典型功能,实际细节请参见官方数据手册)。

三、典型应用场景

  • 电机驱动与逆变器(工业伺服、变频器);
  • 开关电源与有源前端(半桥 LLC、同步整流);
  • 太阳能逆变、UPS 与电源管理系统;
  • 需要高/低侧快速切换的功率转换电路。

四、设计与使用建议

  • VCC 选择在 10V~20V 范围内,常用 12V 或 15V,以兼顾可靠性与开关损耗;
  • 门极电阻应根据器件输入电容与系统电磁兼容(EMC)要求选配,配合器件的 IOH/IOL 能力调整上/下降时间;
  • 高侧浮动节点布线要短且阻抗低,bootstrap 电容与整流二极管应靠近器件布置;
  • 注意散热与结温管理,SOIC-14 封装需评估 PCB 散热路径与功率损耗,避免长期高温工作。

五、封装与热管理

SOIC-14 封装便于常规 PCB 组装与测试,但散热能力受限,建议在 PCB 设计时采用铜桩、加大散热铜箔并优化热回流路径;在高占空比或频繁开关场景下,应评估结温并必要时做热降额设计。

六、总结

IR21834SPBF 为双通道高/低侧半桥驱动器,适配 MOSFET 与 IGBT,在工业级温度范围内提供较强的瞬态驱动能力(IOH/ IOL、tr/tf 等),适合多种功率转换与电机驱动应用。具体保护特性、引脚定义与典型应用电路请参考 Infineon(英飞凌)官方数据手册与应用说明以获得完整设计信息。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.