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Infineon BSL202SNH6327XTSA1
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Infineon BSL202SNH6327XTSA1
- Type
- INFINEON
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- INFINEON
- Electronic Component
- BSL202SNH6327XTSA1
- Electronic Component
- 1
- Package
- TSOP-6
- Electronic Component
- MOSFET
- Electronic Component
- MOSFET
- Electronic Component
- 0g
- Electronic Component
- 1
- FET Type
- N
- Electronic Component
- BM0264903727
- Type
- Surface Mount
- Operating Temperature
- 55°C ~ 150°C（TJ）
- Package / Housing
- SOT-23-6, TSOT-23-6
- Vgs
- ±12V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSL202SNH6327XTSA1 产品概述
一、产品简介
BSL202SNH6327XTSA1 是英飞凌（Infineon）的一款 N 沟道功率 MOSFET，适用于 20V 额定电压的低压开关应用。器件采用 TSOP-6（SOT-23-6 细型）表面贴装封装，设计目标为高电流密度与小封装热管理之间的平衡，适合便携和板级电源开关应用。
二、主要规格亮点
- 漏源电压 Vdss：20 V
- 连续漏极电流 Id（Ta）：7.5 A（受 PCB 热阻限制）
- 导通电阻 Rds(on)：最大 22 mΩ @ Id=7.5 A，Vgs=4.5 V
- 门阈电压 Vgs(th)：最大 1.2 V @ Id=30 μA（低门限，利于逻辑电平驱动）
- 最大栅极电压：±12 V
- 总栅极电荷 Qg：最大 8.7 nC @ Vgs=10 V
- 输入电容 Ciss：最大 1147 pF @ Vds=10 V
- 功率耗散 Pd（Ta）：2 W（无额外散热条件）
- 工作结温范围 TJ：-55°C ~ 150°C
三、典型应用场景
适合用作低压直流开关及功率级器件，包括：
- 移动设备与便携式电源管理（电池断开、负载开关）
- 同步整流与降压转换器的低侧开关
- 继电器替代与保护电路
- 工业与汽车电子中 12V 及以下电源域的开关控制（注意热管理与浪涌电流）
四、封装与热设计要点
采用 TSOP-6（SOT-23-6）小外形适合高密度 PCB 布局，但热阻相对较高。器件在 Ta 条件下额定 Pd 为 2 W，实际高电流工作时需通过以下措施确保可靠：
- 在 PCB 底部与母线处布宽铜箔并加热沉铜区域或散热汇流盘；
- 使用多层板与通孔热通道（thermal vias）导出封装底部热量；
- 在高频开关场合合理配置栅极电阻，减少切换损耗与振铃。
五、驱动与电路设计建议
- 推荐驱动电压：4.5 V 可获得低至 22 mΩ 的导通阻抗；在 2.5 V 下可实现更低功耗系统兼容但 Rds(on) 会上升，需验证热耗。
- 为限制开关损耗和振铃，建议在栅极串联小电阻（常见 5–100 Ω，根据寄生电感与开关速度调整）。
- 考虑其 Qg 约 8.7 nC 的特性，驱动器需能提供相应瞬时电流以满足切换速度。
- 严禁超过 ±12 V 的栅源电压；推荐在有感性负载时并联钳位或肖特基二极管保护。
六、可靠性与选型提示
器件适合对尺寸和效率有严格要求的应用。实际选型时请参考英飞凌完整数据手册，关注 RthJA、脉冲额定值、SOA 及封装标记等完整参数。PCB 热设计与合适的驱动电路是发挥其高电流能力的关键。
如需进一步的电气特性曲线、封装外形尺寸或参考电路图，可提供具体应用场景以便给出更有针对性的设计建议。
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