WMSIC Electronic Components

Infineon BSC110N06NS3 G BSC110N06NS3

ModelBSC110N06NS3
PackageTDSON-8-EP(5x6)
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon BSC110N06NS3 G
Type
TDSON-8-EP(5X6)
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
BSC110N06NS3 G
Electronic Component
1
Package
TDSON-8-EP(5x6)
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0058413340
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
50W
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSC110N06NS3 G 产品概述

一、产品简介

BSC110N06NS3 G 是英飞凌(Infineon)OptiMOS 系列的一款高性能 N 沟道功率 MOSFET,额定漏源电压 60V,连续漏极电流 50A,适用于对导通损耗和开关性能有较高要求的电源与功率开关应用。器件采用紧凑的 TDSON-8-EP(5×6 mm)封装,带有外露散热焊盘,便于 PCB 热管理。

二、主要参数(典型值)

  • 类型:N 沟道 MOSFET(OptiMOS)
  • 漏源耐压 Vdss:60 V
  • 连续漏极电流 Id:50 A
  • 导通电阻 RDS(on):11 mΩ @ Vgs=10 V, Id=50 A
  • 耗散功率 Pd:50 W
  • 阈值电压 Vgs(th):4 V @ Id=23 μA
  • 总栅极电荷量 Qg:33 nC @ Vgs=10 V
  • 输入电容 Ciss:2.7 nF
  • 输出电容 Coss:590 pF
  • 反向传输电容 Crss:17 pF
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:TDSON-8-EP(5×6 mm)

三、关键特性与优势

  • 低导通电阻(11 mΩ@10 V)在导通损耗上表现优异,适合高电流路径,能有效降低导通发热与系统能耗。
  • OptiMOS 工艺优化了开关特性与寄生电容,使得器件在中高频开关下具有较好的综合开关效率。
  • 33 nC 的栅极电荷量表明驱动能量适中,需匹配合适的栅极驱动器以达成快速开关并控制开关损耗与 EMI。
  • 紧凑的 TDSON-8-EP 封装带外露焊盘,便于在 PCB 上实现低热阻散热路径,适合集成密度较高的电源方案。

四、典型应用场景

  • 同步整流器与降压/升压 DC-DC 转换器(中高功率等级)
  • 开关电源(SMPS)、服务器与通信电源模块
  • 马达驱动(低压大电流场合)
  • 负载开关与电池保护电路
  • 汽车电子(需要注意电压与热管理要求)

五、驱动与布局建议

  • 推荐在 10 V 门极驱动下以获得标称 RDS(on);Vgs(th)=4 V 表明在 5 V 驱动下未必能达到最低导通电阻,应在电路设计时验证导通损耗。
  • 栅极电荷 Qg=33 nC 需要驱动器能提供瞬时充放电电流,若切换频率较高,应选用低阻抗、快速响应的栅极驱动器并考虑功率耗散。
  • 布局时应尽量缩短高电流回流回路,增大外露焊盘与散热层之间的焊接面积,使用多层走铜和热过孔以降低结-壳及结-板温升。
  • 在关断/开通瞬态中注意 Crss 对米勒效应的影响,合理配置栅极电阻以平衡开关损耗与 EMI。

六、热管理与可靠性

  • 器件允许工作温度最高可达 +150 ℃,但为保障长期可靠性与降低导通损耗,应控制结温尽量低于最大值。
  • 利用外露焊盘与底层散热铜箔并配合合适的散热器或散热铜柱,有助于将 Pd 的热量有效转移至 PCB 或外部散热结构。
  • 在高脉冲功率或极端温度环境中,应参考厂商的 SOA(安全工作区)与热阻数据进行详细热仿真与测试。

七、总结

BSC110N06NS3 G 以 60V/50A 的电气规格、低 RDS(on) 与 OptiMOS 优化的开关性能,适合中高功率密度的电源与开关应用。合理的栅极驱动与良好的 PCB 热设计是发挥其性能的关键。针对具体应用,建议在开发前进行开关损耗、热仿真与实际测试以确认系统级表现。

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