WMSIC Electronic Components

Infineon IRLZ44NSTRLPBF

ModelIRLZ44NSTRLPBF
PackageD2PAK
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon IRLZ44NSTRLPBF
Type
INFINEON
Unit
Electronic Component
Minimum package
800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
IRLZ44NSTRLPBF
Electronic Component
1
Package
D2PAK
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.219g
Electronic Component
1
Electronic Component
BM0227644976
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
3.8W
Electronic Component
Electronic Component
Electronic Component
800
Voltage(Vdss)
55V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IRLZ44NSTRLPBF 产品概述

一、产品简介

IRLZ44NSTRLPBF 是英飞凌(Infineon)推出的一款单通道 N 沟增强型功率 MOSFET,采用 D2PAK(表面贴装的大功率封装)。该器件设计用于中低压、高电流开关应用,具有较低导通电阻和中等栅极电荷,适合作为功率开关管用于驱动、开关电源和电机控制等场合。

二、主要电气参数

  • 漏源耐压 Vdss:55 V
  • 连续漏极电流 Id:47 A
  • 导通电阻 RDS(on):22 mΩ @ VGS = 10 V(在 25 A 条件下)
  • 阈值电压 VGS(th):约 1 V
  • 总栅极电荷 Qg:48 nC(典型)
  • 输入电容 Ciss:1.7 nF
  • 反向传输电容 Crss(Miller 电容):150 pF
  • 功率耗散 Pd:3.8 W(封装与散热条件影响较大)
  • 数量:1 个 N 沟道 MOSFET

三、关键特性与优势

  • 低导通损耗:22 mΩ 的 RDS(on) 在 10 V 驱动下能有效降低导通损耗,适合要求低压降的大电流路径。
  • 宽温度适应性:标称工作温度范围 -55 ℃ 至 +175 ℃,适合严苛环境应用。
  • 便于表面贴装:D2PAK 封装利于自动化装配和 PCB 散热布局。
  • 合理的栅极电荷:Qg=48 nC 在驱动器设计上处于中等水平,平衡了开关速度与驱动能耗。

四、典型应用场景

  • 同步降压 / 直流-直流 转换器(主开关或同步整流)
  • 电机驱动和 H 桥开关(中小功率电机)
  • 负载开关、继电器替代、汽车电子子系统(在符合温度与电磁兼容要求下)
  • UPS、逆变器等需要高电流处理的功率模块

五、设计与使用建议

  • 驱动电压:为充分利用低 RDS(on),建议在开通时给出接近 10 V 的栅极驱动电压;若采用逻辑电平驱动(5 V),需验证导通电阻对系统损耗的影响。
  • 栅极驱动能力:Qg=48 nC 需要合适的驱动电流以实现期望的开关速度,选择驱动器时注意其峰值电流和驱动速度。
  • 板级散热:Pd=3.8 W 表明在无额外散热时功耗能力有限,推荐使用大面积铜箔、散热垫或外部散热片以降低结温,确保长期可靠性。
  • 抑制和布局:Crss=150 pF 会影响开关瞬态(Miller 效应),在快速开关时需要合适的门极串联电阻(典型 5–20 Ω,视系统和 EMI 要求调整)和良好地包围退耦电容以控制振铃与过冲。
  • 保护措施:建议在实际电路中并用 TVS、斜坡驱动或电流检测限流,避免过压和短路造成器件失效。

六、注意事项与可靠性

  • 额定参数通常在特定测试条件(例如 Tj=25 ℃)下测得,实际电路中结温升高会明显影响 RDS(on) 与 Pd,设计时留有余量。
  • D2PAK 虽便于焊接与散热,但焊接工艺(回流温度、散热铜区设计)对器件的热阻与长期可靠性有显著影响。
  • 在高频换向或重载循环应用中,应关注器件的热循环与 SOA(安全工作区)限制,必要时参考英飞凌的详细数据手册和应用注意事项。

总结:IRLZ44NSTRLPBF 是一款适用于中低压、高电流场合的 N 沟 MOSFET,具有低导通电阻和良好的温度适应能力。合理的栅极驱动与散热设计能让其在开关电源、驱动器和功率开关等应用中发挥良好性能。若需更详细的电气特性曲线或封装图,建议参阅厂商最新数据手册。

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