WMSIC Electronic Components

Infineon BTF3050TE

ModelBTF3050TE
PackageTO-252-4
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon BTF3050TE
Type
INFINEON
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
BTF3050TE
Electronic Component
1
Package
TO-252-4
Type
Switch
Electronic Component
Power Electronic Switch
Electronic Component
1g
Electronic Component
1
Channel Count
1
Electronic Component
BM0265395672
Resistor
50mΩ
Operating Temperature
40℃~+150℃
Operating Voltage
3V~5.5V
Current
3A
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

英飞凌BTF3050TE低侧功率开关产品概述

BTF3050TE是英飞凌(Infineon)推出的单通道低侧功率开关,专为中低功率负载的精准控制设计,集成多重安全保护与高效电气性能,适配3V~5.5V宽电压范围,适用于汽车电子、工业控制及消费电子等场景。

一、核心参数与基础定位

作为单通道低侧开关,BTF3050TE的关键参数明确了其应用边界:

  • 通道与控制:1个独立控制通道,输入为高电平有效,可直接匹配3.3V/5V MCU的IO输出,无需额外电平转换;
  • 功率能力:最大连续电流3A(典型值),导通电阻低至50mΩ,3A电流下导通损耗仅0.45W(I²R计算),热效率优异;
  • 电压范围:工作电压覆盖3V~5.5V,兼容主流嵌入式系统的电源轨;
  • 温度范围:-40℃~+150℃宽温设计,满足工业级与汽车级环境需求;
  • 封装形式:TO-252-4(DPAK)表面贴装封装,体积紧凑(6.1mm×5.0mm×1.6mm),便于PCB布局且散热性能突出。

二、集成多重安全保护功能

BTF3050TE内置四大核心保护,大幅提升系统可靠性,无需额外外围电路:

  1. 过流保护(OCP):负载电流超阈值时自动关断,电流恢复正常后支持自动重启(部分型号),避免过载损坏;
  2. 过热保护(OTP):结温超150℃~170℃时触发关断,温度降至安全范围后自动恢复,防止热失控;
  3. 过压保护(OVP):输入/负载端电压超6V时快速关断,避免高压击穿内部MOSFET;
  4. 短路保护(SCP):负载短路时瞬间限制电流至<5A(典型值),并关断输出,保护电源与负载。

三、电气性能与应用优势

BTF3050TE针对中低功率负载设计,具备以下核心优势:

  • 低损耗高效:50mΩ导通电阻远低于传统继电器/分立MOS方案,减少热耗散,适合高密度PCB;
  • 宽电压兼容:3V~5.5V覆盖大多数MCU IO电平与电源轨,简化系统设计;
  • 快速响应:导通/关断时间<10μs(典型值),满足快速负载切换需求;
  • 高集成度:单芯片集成开关与多重保护,替代“MCU+MOS+保护电路”方案,降低BOM成本与空间占用。

四、典型应用场景

结合参数与性能,BTF3050TE适用于以下场景:

  • 汽车电子:车身控制模块(BCM)小负载(转向灯、示宽灯、座椅通风低功率档)、后视镜电机驱动、车载USB开关;
  • 工业控制:小型继电器驱动、微型直流电机(阀门)控制、3A大功率LED驱动、PLC输出模块;
  • 消费电子:智能家居(窗帘电机、智能插座小负载)、移动电源输出开关、便携设备负载切换。

五、应用注意事项

为保障稳定工作,需注意:

  1. 散热设计:3A连续电流下,PCB需增加10mm²以上铜箔,或加装小型散热片;
  2. 感性负载防护:驱动电机/继电器时,并联1N4007续流二极管,防止反向电动势损坏;
  3. 控制端防护:控制输入串联100Ω~1kΩ电阻,避免静电/过流损坏MCU;
  4. 电源滤波:输入并联10μF电解+0.1μF陶瓷电容,滤除纹波提升稳定性。

总结:BTF3050TE以高集成度、宽电压、多重保护及低损耗为核心优势,是中低功率负载控制的高性价比选择,尤其适合对可靠性与空间要求严格的汽车、工业及消费电子领域。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.