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Infineon BC807UE6327HTSA1
Configuration
1 options
Configuration
23+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Infineon BC807UE6327HTSA1
- Type
- INFINEON
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- INFINEON
- Electronic Component
- BC807UE6327HTSA1
- Electronic Component
- 1
- Package
- SC74-6
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0g
- Electronic Component
- Infineon Technologies
- Electronic Component
- 1
- Electronic Component
- BM0264595653
- Type
- Surface Mount
- Operating Temperature
- 150°C（TJ）
- Electronic Component
- Electronic Component
- Package / Housing
- SC-74，SOT-457
- Transistor Type
- 2 PNP
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BC807UE6327HTSA1 产品概述
一、概述
BC807UE6327HTSA1 是英飞凌（Infineon Technologies）出品的双路 PNP 晶体管，封装为表面贴装 SC-74（SOT-457，PG-SC74-6），以卷带（TR）方式供货。器件面向通用放大和开关应用，但器件状态标注为“不适用于新设计”，在新项目选型时需注意替代件规划。
二、主要性能参数
- 晶体管类型：2 路 PNP（双）
- 集电极最大电流 Ic：500 mA
- 集射极击穿电压 VCEO：45 V
- 饱和压降 VCE(sat)（最大值）：约 700 mV（在规格书给定的 Ib/Ic 工作点下测得）
- 集电极截止电流 ICBO（最大值）：100 nA
- 直流电流增益 hFE（最小值）：160 @ Ic=100 mA, VCE=1 V
- 过渡频率 fT：200 MHz
- 最大耗散功率：330 mW
- 结温 TJ：最高 150 °C
三、封装与安装
SC-74 六引脚小型表面贴装封装，适合紧凑电路板布局与自动化回流焊工艺。卷带（TR）包装有利于批量贴装与生产线供应链管理。引脚排列与封装热阻限制决定了在高电流或高功率工况下对 PCB 散热设计的要求。
四、热管理与可靠性注意事项
器件最大耗散功率为 330 mW，且在 500 mA 峰值电流下仍受限于封装散热能力。建议：
- 在高电流或连续导通场合采取良好铜箔散热与热过孔布局；
- 参考规格书中的结-焊盘热阻与功率退避曲线进行温度评估；
- 避免长期在接近 TJ 上限工作的环境，以延长可靠性。
五、典型应用
- 低电压信号放大与驱动电路（音频前端、驱动小型继电器或指示灯）；
- 高侧 PNP 开关或互补对（与 NPN 配合构成推挽级）；
- 便携式与消费类电子中对空间和成本敏感的双通道晶体管需求。
六、选型与使用建议
- 评估是否接受“不适用于新设计”的器件状态，长期项目建议寻找长期供货或替代件；
- 依据 hFE 与饱和压降在目标工作点的表现，合理配置基极电流以保证开关和放大性能；
- 在设计阶段预留热裕量并在 PCB 上优化散热路径；
- 参考英飞凌完整规格书获取精确测试条件与典型曲线，尤其是 VCE(sat)、hFE 随温度与电流的变化。
如需更详细的电气特性曲线、封装外形图或替代型号推荐，可进一步提供具体应用场景与工作条件。
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