WMSIC Electronic Components

Infineon IPD50R380CE

ModelIPD50R380CE
PackagePG-TO-252
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon IPD50R380CE
Type
INFINEON
Minimum package
2500

Technical parameters

Electronic Component
INFINEON
Electronic Component
IPD50R380CE
Electronic Component
1
Package
PG-TO-252
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.49g
Electronic Component
1
Electronic Component
BM0263496874
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
98W
Electronic Component
2500
Voltage(Vdss)
500V
Capacitor(Ciss)
584pF
Output Capacitor(Coss)
40pF
Gate (Qg)
24.8nC@10V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IPD50R380CE 产品概述

一、产品简介

IPD50R380CE 是英飞凌(Infineon)推出的一款单只N沟道功率MOSFET,采用PG-TO-252(DPAK)封装。器件针对中高压开关应用进行了优化,具有500V的漏源耐压、较低的导通电阻和适度的栅极电荷,使其在离线开关电源、功率因数校正(PFC)、反激/正激转换器以及中小功率逆变应用中表现良好。器件额定耗散功率98W,工作温度范围宽(-55℃~+150℃),适合工业环境与长寿命应用场景。

二、主要电气参数

  • 类型:N沟道场效应晶体管(MOSFET),单只
  • 漏源电压 Vdss:500 V
  • 连续漏极电流 Id:14.1 A
  • 最大耗散功率 Pd:98 W(具体散热条件以器件资料为准)
  • 导通电阻 RDS(on):380 mΩ @ VGS = 13 V
  • 阈值电压 Vgs(th):约 3 V
  • 总栅极电荷 Qg:24.8 nC @ VGS = 10 V
  • 输入电容 Ciss:584 pF
  • 输出电容 Coss:40 pF
  • 工作结温范围:-55 ℃ 至 +150 ℃
  • 封装:PG-TO-252(DPAK)

三、特性与优势

  1. 中高压耐压(500V):满足大多数离线以及高压直流链路的要求,可直接用于400VAC整流后电压等级或高压链路开关器件。
  2. 适度的导通电阻(380 mΩ):在中小功率范围内可以取得较好的导通损耗与开关损耗平衡,适合功率在几十瓦到数百瓦的电源拓扑。
  3. 较低的栅极电荷(24.8 nC):降低门极驱动能量需求及驱动器尺寸,有利于提高开关频率与减小驱动器热耗。
  4. DPAK 表面贴装封装:便于SMT工艺和自动化装配,同时便于在PCB上通过大铜铺和散热片实现热管理。

四、典型应用场景

  • 离线开关电源(SMPS):尤其是反激、正激或半桥前端的开关管或同步整流管。
  • 功率因数校正(PFC)电路:升压PFC一级开关使用,适用于中等功率等级。
  • LED 驱动与工业照明电源:高压、恒流开关实现。
  • 小功率逆变器与变频器:在中高压侧作为主开关器件。
  • UPS 与电源备份系统中的开关与保护电路。

五、驱动与开关建议

  • 驱动电压:器件在 VGS = 10–13 V 区间时表现较佳,建议采用 10–12 V 的门极驱动电压以兼顾开通迅速与安全余量。
  • 栅极限流:根据系统开关速度要求,可串联 10–47 Ω 的门极电阻以抑制振铃与控制 dv/dt;在高频应用中应权衡栅极电阻与开关损耗。
  • 驱动能力:Qg = 24.8 nC 意味着在快速开关下需要一定的驱动电流,驱动器应能短时间提供数百毫安至数安的脉冲电流以实现理想切换。

六、热管理与布板要点

  • 封装为 DPAK(PG-TO-252),应利用大的铜箔面积并通过多个过孔将热量传导至 PCB 另一侧或散热片。
  • 保持器件源、漏高电流回路走线最短、最粗,减少寄生电感与电阻以降低开关损耗与EMI。
  • 在高功率场合建议器件焊接到金属散热片或使用导热胶,确保结-壳和结-板热阻最小化,避免长期高结温导致失效。
  • 注意器件的最大耗散能力依赖于散热条件与结温,设计时应留有安全裕度,并参考Datasheet中结温与Pd的规范曲线。

七、可靠性与使用注意

  • 器件工作结温上限 ±150 ℃,长期在高温下工作会加速器件退化,应优先考虑温度管理和热循环应力。
  • 在高 dv/dt 和重复冲击条件下,应评估开关瞬态与应力,必要时增加吸收电路(RCD、RC、钳位二极管等)保护器件避免能量回灌或过压。
  • 储存与焊接注意事项:遵循JEDEC包装与回流焊温度规范,避免潮湿引起的焊接缺陷(若干需要烘烤处理按厂商建议)。

八、选型与替换建议

在选型时除主要参数(Vdss、RDS(on)、Id、Qg)外,还应对照开关拓扑、频率、效率目标与热设计。若需要更低导通电阻或更高电流容量,可向上寻找RDS(on)更低或封装热性能更好的型号;若对开关能量吸收或抗浪涌能力有更高要求,需比较EAS/ avalanche能量参数并做相应保护设计。

总结:IPD50R380CE 以其500V耐压、适度的导通电阻与较低栅极电荷,适合用于多类中高压开关电源与工业电源应用。在实际设计中,需结合合适的门级驱动、良好的PCB热处理与必要的浪涌抑制措施,才能发挥器件最佳性能与可靠性。若需更详尽的电气及热参数(如Rth,j‑c、EAS曲线等),建议参考英飞凌官方Datasheet。

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