WMSIC Electronic Components

Infineon IRF40R207

ModelIRF40R207
PackageTO-252
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon IRF40R207
Type
INFINEON
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
IRF40R207
Electronic Component
1
Package
TO-252
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.52g
Electronic Component
1
Electronic Component
BM0228685640
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
83W
Electronic Component
Electronic Component
Electronic Component
2000
Voltage(Vdss)
40V
Capacitor(Ciss)
2.11nF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IRF40R207 产品概述

一、概述

IRF40R207 是英飞凌(Infineon)推出的一款高性能 N 沟道功率 MOSFET,额定漏源电压 40V,单只器件在合适散热条件下可承受连续漏极电流 56A,导通电阻极低,适用于中高电流、低压差功率开关场合。封装为 TO-252(DPAK),便于表面贴装与散热管理。

二、主要参数

  • 类型:N 沟道 MOSFET(场效应管)
  • 漏源电压 Vdss:40V
  • 连续漏极电流 Id:56A
  • 导通电阻 RDS(on):5.1 mΩ @ Vgs = 10V
  • 耗散功率 Pd:83W
  • 阈值电压 Vgs(th):3.9V @ 250 μA
  • 栅极电荷 Qg:68 nC @ Vgs = 10V
  • 输入电容 Ciss:2.11 nF
  • 反向传输电容 Crss:220 pF
  • 工作温度范围:-55 ℃ ~ +175 ℃
  • 封装:TO-252(DPAK)
  • 单位数量:1 颗

三、特性与优点

  • 低导通电阻(5.1 mΩ)在 10V 驱动下能显著降低导通损耗,适合高效率设计。
  • 较高的连续电流能力(56A)适用于大电流开关与并联使用场景。
  • 较大的总栅电荷(68 nC)表明开关时需要相对较强的驱动能力,利于快速切换但对驱动器有要求。
  • Ciss 与 Crss 值说明开关动态特性,Crss 对开关过冲与回灌影响较明显,应通过布局与阻尼控制寄生振荡。
  • 宽温度范围与较高功耗能力(Pd 83W)使其在工业级环境中具有良好可靠性。

四、典型应用

  • 开关电源(SMPS)与同步整流
  • DC-DC 降压转换器与电源管理模块
  • 电机驱动与电流控制电路
  • 汽车电子(需注意整车瞬态保护)
  • 高效负载开关与功率分配单元

五、选型与使用建议

  • 驱动电压:建议采用接近 10V 的栅极驱动以达到标称 RDS(on),若使用 12V 驱动应验证器件极限;在低电压驱动(如 5V)下导通电阻将显著上升。
  • 驱动器能力:考虑 Qg=68 nC,驱动器需具备足够峰值电流以实现所需开关速度,必要时加入栅极电阻(10–100 Ω)以抑制振荡与限流。
  • 布局与寄生:尽量缩短漏、源、栅的走线,采用大铜面积散热,源极回流路径要低阻抗,Crss 带来的电压耦合需通过吸收电路或缓冲网络处理。
  • 保护电路:在含有感性负载或开关变换中加入 TVS、RC 抑制或回扫二极管以防止瞬态超过 Vdss。

六、封装与热管理

TO-252(DPAK)封装利于表贴生产并可通过底部铜箔及散热片提高热散能力。尽管额定 Pd 可达 83W,但实际功耗能力依赖 PCB 散热设计与环境条件,建议按照实际工作电流、占空比与结-环境热阻进行热仿真与温升评估,并为关键应用留有充足的热裕量。

七、注意事项

  • 在并联使用时需考虑 RDS(on) 匹配与热均流;
  • 长期工作在高温或接近额定极限会影响可靠性,应进行适当降额;
  • 器件参数通常按特定测试条件给出,设计时应参考完整数据手册并进行实际测量验证。

IRF40R207 以其低阻、高电流与工业级温度特性,适合要求效率与可靠性兼顾的中低压功率开关场合。设计时关注驱动、寄生与散热三要素,可最大化其性能表现。

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