Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Nexperia 74LVC86APW,118 74LVC86APW
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Nexperia 74LVC86APW, 118
- Type
- TSSOP-14
- Unit
- Electronic Component
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- NEXPERIA
- Electronic Component
- 74LVC86APW,118
- Electronic Component
- 1
- Package
- TSSOP-14
- Electronic Component
- Logic Gate
- Electronic Component
- 74LVC
- Electronic Component
- 0.161g
- Electronic Component
- 1
- Channel Count
- 4
- Features
- Electronic Component
- Electronic Component
- BM0000279780
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 1.2V~3.6V
- Logic Type
- Gate
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：74LVC86APW,118
一、基本信息
74LVC86APW,118是一款集成电路，属于74LVC系列。该系列的逻辑电路设计用于低电压环境，具备高性能和低功耗的特性，特别适合在电池供电的应用中。该器件采用表面贴装封装（14-TSSOP），符合现代电子产品对小型化和高效率的需求。74LVC86APW,118具体为四个异或门（XOR），每个门有两个输入，适用于复杂逻辑运算和数据处理。
二、性能特征
- 逻辑电路归属：74LVC86系列
- 逻辑类型：XOR（异或）门
- 电路/元件数：4个独立异或门
- 输入数/每元件位数：2
- 工作电压范围：1.2V ~ 3.6V，极大地提升了其在低电压环境下的适用性。
- 静态电流：最大静态电流为40µA，保证了本器件在待机状态下的低功耗表现。
- 输出电流：高、低输出电流均为24mA，能够驱动大多数常见负载。
- 逻辑电平：逻辑低电平范围在0.7V ~ 0.8V，逻辑高电平范围在1.7V ~ 2V，确保电平兼容性。
- 最大传播延迟：在3.3V和50pF负载下，最大传播延迟为5ns，适合高速数字电路的使用。
- 工作温度范围：-40°C ~ 125°C，能够在恶劣环境下稳定工作，满足工业及汽车应用需求。
三、封装与安装
74LVC86APW,118采用14-TSSOP封装，封装尺寸为0.173"（约4.40mm宽），是当前流行的紧凑型封装之一。表面贴装型设计使得在自动化装配和高密度PCB设计中更具优势，尤其是在空间有限的智能手机、可穿戴设备及其他便携式电子设备中。
四、应用场景
由于74LVC86APW,118的低电压、高性能特性，其适用范围非常广泛，包括但不限于：
- 消费电子：如智能手表、智能手机及其他便携式设备。
- 工业控制：用于自动化设备的逻辑控制。
- 汽车电子：在汽车的控制系统中，用作信号处理和逻辑运算。
- 通信设备：在网络硬件中清晰的逻辑处理，提升信号处理能力。
五、设计参考与支持
安世半导体(Nexperia)为74LVC86APW,118提供充分的技术支持，包括详细的数据手册、应用笔记及设计指南，帮助工程师在选择和配置时能够高效、准确。同时，集成电路内部的结构设计也考虑到了电路的稳定性与可靠性，降低了因温度变化或电源波动造成的故障几率。
六、总结
74LVC86APW,118是一款具备良好电气性能及温度容限的异或门逻辑集成电路，适用于广泛的低电压电子产品和高性能应用。其小巧的14-TSSOP封装使得它在现代设计中表现出色，尤其是在要求高密度和低功耗的应用场景中。凭借安世的品牌保障和多样的应用支持，74LVC86APW,118为设计工程师提供了一个稳健、高效的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
