WMSIC Electronic Components

KEMET C0402C680J5GACAUTO

ModelC0402C680J5GACAUTO
Package0402
BrandKEMET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 140758

Availability on request

Technical data

Product details

18 specifications

Core information

Product name
KEMET C0402C680J5GACAUTO
Type
KEMET
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KEMET
Electronic Component
C0402C680J5GACAUTO
Electronic Component
1
Electronic Component
68pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.012g
Electronic Component
1
Electronic Component
BM0265741841
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KEMET C0402C680J5GACAUTO 产品概述

一、产品简介

KEMET C0402C680J5GACAUTO 是一款表面贴装多层陶瓷电容器(MLCC),额定容值 68 pF,公差 ±5%(J),额定电压 50 V,介质为 C0G/NP0,封装尺寸 0402(1005 公制),以自动化贴装卷带(AUTO)形式供货。C0G(NP0)介质具有优异的温度稳定性与极低的介质损耗,适合对频率和温漂有严格要求的电路。

二、主要规格与特性

  • 容值:68 pF
  • 精度:±5%(J)
  • 额定电压:50 V DC
  • 介质:C0G / NP0(温度系数接近 0 ppm/°C,工作温度范围宽)
  • 封装:0402(1005 公制)
  • 包装:卷带自动化包装(适于高速贴片生产)
  • 主要特性:
    • 极低的温度漂移与电容随温度变化小
    • 极低的介质损耗,适合高 Q 应用
    • 良好的电气稳定性与频率响应

三、典型应用场景

  • 高稳定性振荡器与谐振电路(时钟、晶体振荡器负载)
  • 射频前端匹配网络与滤波器
  • 精密模拟电路(采样/保持、ADC/DAC 前端)
  • 高速数字接口的旁路与互连匹配
  • 电容阵列与温度敏感的参考网络

四、装配与使用建议

  • 焊接:建议按 JEDEC/J-STD-020 推荐的无铅回流曲线进行回流(控制峰值温度与保温时间),避免重复高温回流。
  • 焊盘与焊膏:采用厂家推荐焊盘尺寸与过孔布局,控制焊膏量以避免“浮置”或焊点不足。
  • 机械应力:0402 体积小但对 PCB 弯曲、机械应力敏感,焊接时避免过度板弯或强力压装。
  • 静电与清洁:器件本身非极性,但建议在装配与测试过程中采用常规静电防护与洁净操作。

五、可靠性与合规

C0G/NP0 陶瓷结构稳定、老化率低,适用于长期稳定工作的产品。KEMET 产品通常符合 RoHS 要求并通过相关可靠性测试(如温度循环、湿热、机械冲击等),具体的可靠性数据与认证请参考 KEMET 官方数据表与检验报告。

六、选型提示

  • 若电路对温漂与频率稳定性要求高,C0G/NP0 是首选;若需要更大容值或更高介电常数,则需考虑 X7R、X5R 等介质,但温度稳定性与损耗会下降。
  • 0402 尺寸适合高密度 PCB 布局与自动化生产;如需更高功率承受或更大容值,请选用更大封装。
  • 关注实际工作电压与自我谐振频率(SRF),在高频应用中需考虑电容的寄生参数对性能的影响。

若需更详细的电气参数(如等效串联电阻 ESR、等效串联电感 ESL、温度曲线、最大偏压特性)或封装/焊盘建议图,请告知,我可提供对应的技术资料与布局建议。

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