WMSIC Electronic Components

ON BSS123LT1G

ModelBSS123LT1G
PackageSOT-23
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON BSS123LT1G
Type
ON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
BSS123LT1G
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0093065321
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
225mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
100V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSS123LT1G 产品概述

一、基本信息

BSS123LT1G 是一种 N 通道 MOSFET(金属氧化物半导体场效应晶体管),属于 ON Semiconductor(安森美)的产品系列,采用 SOT-23-3 (TO-236) 表面贴装封装。该器件具有较高的漏源电压(Vdss)和较高的连续漏极电流,这使其在各种高压、大电流应用场合下表现优异。

二、技术规格

  1. FET 类型: N 通道
  2. 漏源电压(Vdss): 100 V
  3. 连续漏极电流(Id): 170 mA (在 25°C 时)
  4. 驱动电压(Vgs): 最大 Rds On 时为 10V
  5. 导通电阻(Rds(on)): 在 Id=100 mA,Vgs=10V 时,最大值为 6 Ω
  6. 阈值电压(Vgs(th)): 最大值为 2.6 V(范畴适用测试条件为 Id=1 mA)
  7. 栅极-源极电压(Vgs): 最大值为 ±20 V
  8. 输入电容(Ciss): 最大值为 20 pF(在 Vds=25 V 时)
  9. 功率耗散: 最大值为 225 mW(在环境温度下)
  10. 工作温度范围: -55°C 至 150°C
  11. 封装类型: SOT-23-3(TO-236)

三、应用场合

BSS123LT1G 在电子设计中应用广泛,适用于如下领域:

  • 电源管理: 由于其高电压和电流承载能力,BSS123LT1G 可用于开关电源(SMPS)与电压稳压器电路。其良好的导通特性和低导通电阻使其在高效能电源设计中表现突出。
  • 信号开关: 该 MOSFET 可用于低功耗信号的切换,实现信号的高效传输和频率控制。
  • 负载驱动: 在各类负载驱动电路中,尤其是小功率负载,BSS123LT1G 可实现精确的电流控制和增强的驱动能力。
  • 便携设备: 鉴于其小型化的 SOT-23 封装,该 MOSFET 适用于空间要求严格的便携式设备中,如手持式电子产品、移动电子设备等。

四、优势与特点

  • 高温稳定性: 面对较大温度变化,BSS123LT1G 的工作温度范围为 -55°C 至 150°C,适用于严苛的工作环境,能够有效保持器件的性能稳定。
  • 低导通电阻: 最大导通电阻为 6 Ω,可以在较低的驱动电压条件下实现高效的电流传输,减少功率损耗。
  • 小型封装: SOT-23-3 封装使其在高度集成的电路中具有极大的空间优势,也便于自动化生产和简化焊接流程。
  • 应用灵活性: 支持多种类型的电路设计,能够满足不同客户的需求,适合多种行业。

五、总结

BSS123LT1G 作为一款高性能 N 通道 MOSFET,凭借其优越的电气特性和广泛的应用范围,成为电子设计工程师的理想选择。无论是在电源管理、信号开关,还是在便携设备的负载驱动中,该元件都能提供可靠的解决方案,助力实现高效能和高可靠性的电子产品设计。选择 BSS123LT1G,您将获得性能和品质兼具的优秀MOSFET解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.