WMSIC Electronic Components

ON MMBFJ175LT1G

ModelMMBFJ175LT1G
PackageSOT-23
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON MMBFJ175LT1G
Type
ON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
MMBFJ175LT1G
Electronic Component
1
Package
SOT-23
Electronic Component
1 P
Electronic Component
MOSFET(JFET)
Electronic Component
0.03g
FETType
P
Electronic Component
1
Electronic Component
BM0124732981
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
225mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:MMBFJ175LT1G

MMBFJ175LT1G 是安森美(ON Semiconductor)出品的一款高性能 P 通道结型场效应管(JFET),专为低功耗应用而设计。这款 FET 采用 SOT-23-3(TO-236)封装,适用于表面贴装,符合现代电子产品对空间与性能的双重需求。其优越的电气特性和广泛的工作温度范围使其在各种电子电路中都能发挥重要作用。

关键参数和特性

  1. FET 类型:MMBFJ175L 是 P 通道 JFET,具有良好的输入线性度和高输入阻抗,特别适用于放大和开关电路。

  2. 电压特性:该器件的击穿电压(V(BR)GSS)高达 30V,确保其在高负载条件下的可靠性,适合用作电流开关和线性调节器。

  3. 漏极电流:在旁路条件下(Vgs=0),该 FET 的漏极电流(Idss)为 7mA @ 15V。这个参数表明,在特定的条件下,其能够提供稳定的电流输出,为电路设计提供更多的灵活性。

  4. 停止电压:截止电压(VGS off)为 3V @ 10nA,这意味着在该电压下,该 FET 将完全关闭,有效阻止电流通过,适用于高精度的控制电路。

  5. 输入电容:在不同的(Vgs=10V)条件下,其输入电容(Ciss)最大值为 11pF。这一特性使得它在高频应用中,能有效减少信号损耗,确保信号的完整传输。

  6. 导通电阻:RDS(On) 为 125 Ohms,表示在导通状态下,该器件的电阻非常小,有助于实现更高的效率与更低的功耗,对于电源管理电路尤其重要。

  7. 功率能力:该器件的最大功耗为 225mW,使其在多种应用场景中都能够安全稳定工作,尤其是在对功耗有严格要求的便携式设备中表现出色。

  8. 工作温度:其工作温度范围为 -55°C 至 150°C,适合于极端环境下的应用,符合工业、汽车及航空航天领域的需求。

应用场景

MMBFJ175LT1G 的设计使其适用于多种电子应用,包括但不限于:

  • 信号放大器:由于其高输入阻抗和良好的线性特性,特别适合用于音频和信号处理电路。

  • 开关应用:在各种数字和模拟电路中,可用作开关元件,以控制高功率负载或实现信号的选择。

  • 电源管理:在电源控制电路中,能够有效地调节流过的电流,并对负载进行精确控制。

  • 传感器:由于其低功耗特性,能够在传感器应用中延长电池寿命,并减少维护成本。

封装与安装

MMBFJ175LT1G 采用 SOT-23-3 封装,使其在 PCB 上占用空间小,适合密集布板的电子设计。表面贴装技术(SMD)简化了生产过程,提高了装配的自动化水平,从而降低了生产成本。

结论

综上所述,MMBFJ175LT1G 是一款性能优良、应用广泛的 P 通道 JFET,适用于各种要求高效能与小型化的场合。无论是在信号处理、开关控制还是电源管理,MMBFJ175LT1G 都能够提供卓越的性能,是现代电子设计师值得信赖的选择。其持久的耐温性和960名蛙类的高压特性,亦使它在恶劣环境中展现出非凡的可靠性,为各种应用场景提供了强有力的支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.