Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ON MMUN2113LT1G
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ON MMUN2113LT1G
- Type
- ON
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ON
- Electronic Component
- MMUN2113LT1G
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 PNP
- Electronic Component
- Digital Transistor
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0266064401
- Operating Temperature
- 55℃~+150℃
- Resistor
- 1
- Resistor
- 47kΩ
- Transistor Type
- PNP
- Power Dissipation(Pd)
- 246mW
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMUN2113LT1G 产品概述
概述
MMUN2113LT1G 是一款 NPN 型数字晶体管，属于 ON Semiconductor (安森美) 的产品线，专为低功耗和高集成度的电子应用而设计。该晶体管采用表面贴装型 (SMD) 封装 SOT-23-3（TO-236），使其成为许多现代电子电路的理想选择，特别是在空间有限的紧凑型应用中。
主要特性
- 类型: PNP 预偏置类型晶体管
- 集电极电流 (Ic): 最大 100mA，适合驱动多种低功耗负载。
- 集射极击穿电压 (Vce): 最大 50V，提供了较好的耐压性能，使其适用于高电压应用场合。
- 功耗: 最大功率为 246mW，适合在低功耗设计中使用，帮助降低整个电路的能量消耗。
- 电流增益 (hFE): 在 5mA 的集电极电流和 10V 的偏置条件下，hFE 最小值为 80，确保了良好的放大性能。
- 饱和压降 (Vce(sat)): 在 300µA 和 10mA 的条件下，Vce 饱和压降最大值为 250mV，降低了导通时的功耗，提高了整体效率。
- 基极电阻 (R1): 47 kΩ，这一预 bias 设计使得器件在开关应用中表现出色。
- 发射极电阻 (R2): 同样为 47 kΩ，配合基极电阻，共同提高了电流增益和开关速度。
- 截止电流: 在集电极截止 (Ic) 条件下，最大为 500nA，降低了静态功耗。
应用场景
MMUN2113LT1G 晶体管的设计使得它非常适合以下应用场景：
- 移动设备: 由于其低功耗和小型封装，适合智能手机、平板电脑等便携式设备。
- 消费电子产品: 适用于音响、电视和其他家用电器，以实现开关控制和信号放大。
- 传感器电路: 在各种传感器中可用来增强信号和驱动负载，提升传感器的响应速度和准确性。
- 通信设备: 主要用于信号放大、开关控制，以及驱动各种通信模块。
- 工业控制: 可用于工控设备中的开关和驱动电路，增强系统的灵活性和可扩展性。
此外，由于其高集电极电流和耐压性能，MMUN2113LT1G 也适用于需要高稳定性和可靠性的工业控制和自动化应用。
封装与安装
MMUN2113LT1G 使用 SOT-23-3（TO-236）封装，尺寸小巧，符合现代电子产品对空间的需求。这种表面贴装型封装便于大量生产和自动化装配，同时也方便在现有电路板上进行安装。
总结
总的来说，MMUN2113LT1G 是一款高性能、低功耗的 PNP 预偏置型数字晶体管，具备多项优良特性，极大地满足了现代电子设备对高集成度、小体积和低功耗的需求。其广泛的应用领域预示着它在未来电子设计中的重要地位，是设计者在实现复杂电路功能时可选用的重要元器件之一。无论是消费电子、工业应用还是通信设备，MMUN2113LT1G 都展现出了其优越的性能和可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
