WMSIC Electronic Components

ON MUN5335DW1T1G

ModelMUN5335DW1T1G
PackageSOT-363
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON MUN5335DW1T1G
Type
ON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
MUN5335DW1T1G
Electronic Component
1
Package
SOT-363
Electronic Component
1 NPN, 1 PNP
Electronic Component
Digital Transistor
Electronic Component
0.027g
Electronic Component
1
Electronic Component
BM0209279768
Operating Temperature
55℃~+150℃
Resistor
0.047
Resistor
2.2kΩ
Transistor Type
NPN+PNP
Power Dissipation(Pd)
187mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MUN5335DW1T1G 产品概述

简介 MUN5335DW1T1G 是一款集成数字晶体管,采用SOT-363封装形式,专为实现高效的电子信号放大和开关控制而设计。产品包含1个NPN和1个PNP晶体管,具有预偏压功能,广泛应用于数字电路、信号放大、开关电源和其他需要快速切换和放大的场合。

关键规格参数

  1. 电流和电压特性:

    • 集电极电流(Ic)最大值: 100mA,适合大多数中小负载。
    • 集射极击穿电压(Vce_max): 50V,满足很多高电压应用要求。
    • 集电极截止电流(Ic_off)最大值: 500nA,提供低泄漏特性。
  2. 增益特性:

    • 在5mA的基极电流和10V的集射电压条件下,DC电流增益(hFE)最小为80,这保证了信号的有效放大。
  3. 饱和压降:

    • 在300µA的基极电流和10mA的集电极电流下,Vce饱和压降最大为250mV,确保在开关状态下损耗最小,从而提高电路效率。
  4. 功率输出:

    • 最大功率输出为250mW,能够满足大部分日常电路设计需求。
  5. 电阻特性:

    • 基极电阻(R1)为2.2kΩ,发射极电阻(R2)为47kΩ,提供良好的电流控制。
  6. 封装和安装:

    • MUN5335DW1T1G 采用6-TSSOP, SC-88, SOT-363封装,属于表面贴装型设计,适合现代小型电路板的紧凑布局。

应用场景 MUN5335DW1T1G广泛应用于数字信号处理、高频开关电路、低功耗放大器、传感器驱动和负载开关等众多领域。由于其较低的功耗和良好的增益特性,尤其适合于手持设备、智能家居、汽车电子及各种消费电子产品中需要快速开关和信号处理的场景。

性能优势

  • 高集成度: 此产品将两个通用型号的晶体管集成于一个小型封装内,降低了电路空间占用并提高了系统的可靠性。
  • 优良的开关速度: 由于内部结构优化,该组件支持高频操作,适用于要求快速响应的应用中。
  • 低功耗: 设计上的高效性确保在运行中耗电较低,非常适合对电源管理有较高要求的设备。

总结 MUN5335DW1T1G是一款具有优秀性能和广泛应用潜力的数字集成晶体管,适合各类现代电子设备使用。凭借其合理的规格和紧凑的封装设计,电子工程师可以在多种电路中轻松实现集成与高效能,从而加速新产品的开发周期并降低设计成本。作为安森美电子的一款出色产品,MUN5335DW1T1G无疑是许多项目的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.