WMSIC Electronic Components

ON MC33274ADR2G

ModelMC33274ADR2G
PackageSOIC-14
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON MC33274ADR2G
Type
ON
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
MC33274ADR2G
Electronic Component
1
Package
SOIC-14
Electronic Component
Operational Amplifier
Electronic Component
0.36g
Electronic Component
1
Features
Built-in; ESD
Electronic Component
BM69416006
Operating Temperature
40℃~+85℃
Amplifier
4
Output Current
37mA
(SR)
10V/us
Power Supply Voltage
3V~36V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:MC33274ADR2G 运算放大器

引言

MC33274ADR2G 是由安森美半导体(ON Semiconductor)推出的一款高性能运算放大器,具有多个优秀的特性和广泛的应用潜力。这款运算放大器特别适合于需要低偏置电流、低噪声和高增益带宽积的信号处理任务。它的设计可以满足多种工业、消费及汽车电子应用的需求。

基本参数

MC33274ADR2G 是一款四路通用运算放大器,具有以下关键参数:

  • 放大器类型: 通用
  • 电路数: 4
  • 压摆率: 10V/µs
  • 增益带宽积: 24MHz
  • 输入偏置电流: 300nA
  • 输入补偿电压: 100µV
  • 供电电流: 2.15mA
  • 输出电流(每通道): 37mA
  • 供电电压范围: 单/双(±)3V至36V,或±1.5V至18V
  • 工作温度范围: -40°C至85°C
  • 封装类型: 14-SOIC

性能特点

MC33274ADR2G 的性能特征使其非常适合用于精密模拟信号处理。其较高的增益带宽积(24MHz)和压摆率(10V/µs)确保了在高频应用中,放大器能够迅速响应输入信号的变化。这些特性极大地提升了其在实时信号处理中的绩效。

输入偏置电流仅为300nA,意味着在高阻抗应用中可有效减少信号的失真和噪声,使其在敏感信号处理和仪器放大器中具有极大的优势。从应用的角度看,MC33274ADR2G 在高精度测量系统、音频设备和传感器接口中都能发挥良好表现。

应用领域

由于其出色的性能参数,MC33274ADR2G 特别适合于以下几种应用场合:

  1. 工业自动化: 在控制和监测系统中,MC33274ADR2G 可以用于信号放大、滤波和调理,确保系统的高可靠性和精确性。

  2. 汽车电子: 随着汽车电子系统的复杂性增加,这款运算放大器能够在传感器信号处理、控制模块和电源管理等应用中提供卓越的表现。

  3. 精密仪器: 在需要高灵敏度和低噪声的测量仪器中,MC33274ADR2G 可以作为放大器、比较器或信号处理模块的核心组成部分。

  4. 消费电子: 例如音频放大器和视讯设备,能够满足其高保真传输的需求。

安装与封装

MC33274ADR2G 采用14-SOIC封装,适合于表面贴装技术。该封装位于小尺寸的电路板上,优化了PCB空间的利用率,使其在高度集成的电子设备中更易部署。

该元件的工作温度范围为-40°C至85°C,这使得它能够在苛刻的环境条件下稳定运行,保证了长期的可靠性。

结论

综上所述,MC33274ADR2G 是一款高性能的四路运算放大器,结合其众多优越性能和广泛适用的特性,适合于多种工作环境和应用场景。安森美半导体凭借其创新的设计和制造技术,确保了其整体质量和性能,满足现代电子产品的需求。对于工程师和设计师而言,MC33274ADR2G 无疑是一个值得推荐的选择,能够极大地提升系统性能和可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.