Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMBF170LT1G 是一款由安森美(ON Semiconductor)公司生产的N沟道MOSFET,具有较高的功率效率和广泛的应用范围。这款器件的主要特点包括其杰出的电气性能、优越的热管理能力以及小尺寸的SOT-23封装,非常适合表面贴装应用。该器件的最大漏源电压(Vdss)为60V,适合多种低功耗电源开关和模拟调制应用。
MMBF170LT1G采用SOT-23-3(TO-236)小型表面贴装封装,自身具有更小的占板面积,有助于提高集成电路的整体密度。这种设计使得MMBF170LT1G特别适合于便携式设备和小型电子产品,如智能手机、平板电脑、便携式音箱等。
得益于其良好的电气特性和小巧的封装,MMBF170LT1G广泛应用于以下领域:
MMBF170LT1G是一款优秀的N沟道MOSFET,提供高达60V的漏源电压、500mA的持续电流和最大225mW的功率耗散,符合现代电子应用的需求。其小型的SOT-23封装和广泛的工作温度范围使得其在各种极端环境和紧凑设计中表现出色。无论在电源管理、信号处理,还是低功耗应用中,MMBF170LT1G都能够提供令人满意的性能,非常适合工程师在设计先进电子设备时的使用。安森美作为其制造商,凭借其在半导体领域的丰富经验,为用户提供了值得信赖的解决方案。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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