WMSIC Electronic Components

ON MMBF170LT1G

ModelMMBF170LT1G
PackageSOT-23
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON MMBF170LT1G
Type
ON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
MMBF170LT1G
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0000002092
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
225mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBF170LT1G 产品概述

一、基本信息

MMBF170LT1G 是一款由安森美(ON Semiconductor)公司生产的N沟道MOSFET,具有较高的功率效率和广泛的应用范围。这款器件的主要特点包括其杰出的电气性能、优越的热管理能力以及小尺寸的SOT-23封装,非常适合表面贴装应用。该器件的最大漏源电压(Vdss)为60V,适合多种低功耗电源开关和模拟调制应用。

二、主要参数

  1. 漏源电压 (Vdss): 最大60V,确保在高电压环境下的稳定性和安全性。
  2. 连续漏极电流 (Id): 最大500mA,适合低电流应用,能够有效满足现代电子设备对电流的需求。
  3. 功率耗散: 最大225mW,推动设计在高密度集成时的热管理。
  4. 导通电阻 (Rds(on)): 在200mA和10V的驱动电压下,导通电阻最大为5欧姆,降低了能量损失,提高了系统的总体效率。
  5. 输入电容 (Ciss): 在10V时,输入电容最大为60pF,适合快速开关和高频操作。
  6. 工作温度范围: 从-55°C到150°C,确保在各种极端环境条件下均能稳定工作。
  7. Vgs(th): 在1mA时最大阈值电压为3V,确保实现低电压开关控制。
  8. 驱动电压: 为了确保MOSFET达到最大Rds(on)和最小Rds(on),通常推荐的驱动电压为10V。

三、封装与尺寸

MMBF170LT1G采用SOT-23-3(TO-236)小型表面贴装封装,自身具有更小的占板面积,有助于提高集成电路的整体密度。这种设计使得MMBF170LT1G特别适合于便携式设备和小型电子产品,如智能手机、平板电脑、便携式音箱等。

四、应用领域

得益于其良好的电气特性和小巧的封装,MMBF170LT1G广泛应用于以下领域:

  • 电源管理: 在电源开关、稳压器和稳流电路中,MMBF170LT1G能够有效地控制电源的开关,优化功率输送。
  • 信号处理: 适用于模拟信号开关和音频处理电路,提供精确的信号放大和开关功能。
  • 开关电源: 在LED驱动、电动机控制等应用中,能够实现快速切换,确保高效能。
  • 低功耗应用: 适合于物联网设备和其他需要低能耗的电子产品,确保延长设备的使用寿命。

五、总结

MMBF170LT1G是一款优秀的N沟道MOSFET,提供高达60V的漏源电压、500mA的持续电流和最大225mW的功率耗散,符合现代电子应用的需求。其小型的SOT-23封装和广泛的工作温度范围使得其在各种极端环境和紧凑设计中表现出色。无论在电源管理、信号处理,还是低功耗应用中,MMBF170LT1G都能够提供令人满意的性能,非常适合工程师在设计先进电子设备时的使用。安森美作为其制造商,凭借其在半导体领域的丰富经验,为用户提供了值得信赖的解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.