Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MRA4005T1G 是安森美(ON Semiconductor)提供的一款通用整流二极管,SMA(DO-214AC)贴片封装,典型参数包括:直流反向耐压 Vr = 600V,额定整流电流 1A,正向压降 Vf = 1.18V @ 2A,非重复峰值浪涌电流 Ifsm = 30A,反向电流 Ir = 10µA @ 600V,工作结温范围 -55℃~+150℃。器件定位为中高压、低泄漏的普适整流用途,适合自动贴装生产。
MRA4005T1G 为 SMA(DO-214AC)表面贴装封装,适配常见的回流焊工艺。建议遵循安森美推荐的回流温度曲线和焊盘建议尺寸,避免长时间超温或过冷导致焊点可靠性下降。常见供应形式为纸带卷盘(Tape & Reel),便于自动贴装。
在关键或汽车级应用中,应参考完整 datasheet 和厂家可靠性报告执行验证。选型时关注工作电压余量、长期漏电与温度漂移,并在样机阶段进行实际环境(温度、湿度、浪涌)测试以确认性能稳定性。
总结:MRA4005T1G 是一款面向中高压通用整流的可靠贴片二极管,兼顾低漏电与较低正向压降,适合多种电源与保护场合。选用时请以官方 Datasheet 为准,并结合实际使用工况进行热与电应力评估。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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