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Prisemi PSBD2FD30V01
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Prisemi PSBD2FD30V01
- Type
- DFN1006-2L
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PRISEMI
- Electronic Component
- PSBD2FD30V01
- Electronic Component
- 1
- Package
- DFN1006-2L
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.01g
- Electronic Component
- 1
- Electronic Component
- BM0256938794
- Current
- 100mA
- Diode
- 1
- Current(Ir)
- 10uA@10V
- (Vf)
- 340mV@10mA
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PSBD2FD30V01 产品概述
一、主要特性
PSBD2FD30V01 是一颗小型独立式肖特基二极管，来自 Prisemi(芯导)。其突出特点包括低正向压降和低反向漏电，适合低功耗和高效率整流与保护场合。关键参数：正向压降 Vf = 340 mV @ 10 mA，直流反向耐压 Vr = 30 V，额定整流电流 Io = 100 mA，反向电流 Ir = 10 μA @ 10 V，非重复峰值浪涌电流 Ifsm = 500 mA，结温工作范围 -55 ℃ ~ +125 ℃。封装为 DFN1006-2L，体积极小，适合窄空间应用。
二、电气性能与应用意义
低 Vf（0.34V @10mA）可显著降低在小电流电源轨和整流路径上的压降与功耗，适合便携式设备、传感器电源、低压差稳压和快速整流场合。Vr=30V 使器件可用于 12V 及以下系统的整流与反接保护。Ifsm=500mA 为短时浪涌提供保护，但非重复峰值，不宜作为频繁冲击电流使用。
三、封装与热管理
DFN1006-2L 封装体积小、热阻相对较低但受限于焊盘及铜箔面积。典型连续工作时功耗约为 P = Vf × If，例如在 100 mA 条件下 P ≈ 0.34 V × 0.1 A = 34 mW。尽管功耗不高，仍建议在 PCB 设计时采用较大接地/电源铜箔、短粗走线及必要的散热铜柱或过孔，以保证在高环境温度下稳定工作并延长寿命。
四、典型应用场景
- 低电压电源整流与二次侧整流
- 电池保护与反接保护电路
- 低功耗开关电源前端肖特基整流
- 信号钳位与快速保护元件（非高能量浪涌）
- 精密测量仪器中降低压降的整流/隔离
五、选型与电路实现建议
- 若工作电流长期接近 100 mA，应评估 PCB 散热和环境温度，必要时降额使用。
- 对需承受较高冲击电流的应用，选择更高 Ifsm 或并联多颗器件并做电流均衡。
- 反向漏电在高温下会增大，若系统对漏电敏感（如电池待机），应进一步验证 Ir 随温度的变化。
- 在高频开关环境中，注意肖特基结电容对回路性能的影响，必要时进行实验测量。
六、可靠性与装配注意
- DFN 封装为贴片型，推荐采用常规无铅回流焊工艺，遵循器件厂商的回流曲线与防潮处理。
- 储存与贴装时注意防潮防静电，必要时进行烘烤以避免吸湿引起的焊接缺陷。
- 进行可靠性验证时建议包括温升测试、反复浪涌测试及高温加速寿命测试，以确认在目标应用下的长期性能。
总结：PSBD2FD30V01 适合要求体积小、压降低且耐压约 30V 的整流与保护用途。在 PCB 热设计与使用条件得到合理控制时，可为便携式与工业电子系统提供高效、低损耗的解决方案。若需更详细的封装尺寸、焊盘建议和热阻数据，请参考厂商详细资料或联系供应商获取完整数据手册。
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