Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SN74HC595DR 是由德州仪器(Texas Instruments)推出的一款高性能8位移位寄存器,广泛应用于嵌入式系统和数字电路设计中。该器件具备串行输入、并行输出的功能,并且支持8位数据的串行到并行转换,使其成为实现多通道数据处理、LED驱动等应用的理想选择。
逻辑类型 : 移位寄存器
输出类型 : 三态输出
工作电压 : 2V ~ 6V
位数 : 8位
工作温度范围 : -40°C ~ 85°C
安装类型 : 表面贴装型(SMD)
供应商器件封装 : 16-SOIC
SN74HC595DR 被广泛应用于各种电子设计领域,具体应用包括但不限于:
在使用SN74HC595DR时,设计者需注意以下几点:
电源管理 : 确保工作电压在2V ~ 6V范围内,避免超出这一范围会导致器件损坏或工作异常。
布局设计 : 由于其封装为SMD,PCB布局需留足足够的走线空间,以减少信号干扰和反射。
串联使用 : 可通过级联多个SN74HC595,以实现更高位数的串行数据处理,但需合理设计时钟、数据引脚连接,以确保数据传输的完整性和同步性。
散热问题 : 在高频率工作时,应该考虑电路的散热设计,以避免因过热导致的性能下降或故障。
SN74HC595DR是一款功能强大、应用广泛的8位移位寄存器,凭借其出色的逻辑性能、三态输出和宽广的工作电压范围,成为设计工程师在数字电路设计中的常用器件。无论是在LED显示控制、数据扩展还是在复杂控制逻辑的实现上,SN74HC595DR都能保证高效可靠的性能,是现代电子设计中不可或缺的元件之一。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products