WMSIC Electronic Components

TI TPS62A01DRLR

ModelTPS62A01DRLR
PackageSOT-563
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TI(Texas Instruments) TPS62A01DRLR
Type
TI
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
TPS62A01DRLR
Electronic Component
1
Package
SOT-563
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.033g
Electronic Component
1
Features
Output
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0227368378
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
2.5V~5.5V
Switching Frequency
2.4MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TPS62A01DRLR 产品概述

一、产品简介

TPS62A01DRLR 是德州仪器(TI)推出的一款降压型(Buck)DC-DC稳压器芯片,面向空间和功耗受限的便携与电池供电系统。器件输入电压范围宽(2.5V 至 5.5V),输出电压可调(0.6V 至 5.5V),最大输出电流可达 1A,内部集成开关管与同步整流器,工作开关频率为 2.4MHz,静态电流仅 20µA(待机极低静耗),封装为 SOT-563 小封装,适合体积受限的应用场景。

二、主要特性

  • 输入电压范围:2.5V ~ 5.5V
  • 输出电压范围:可调 0.6V ~ 5.5V
  • 最大输出电流:1A
  • 开关频率:2.4MHz(高速,利于采用小型被动元件)
  • 同步整流:内置(提高效率,降低外部肖特基损耗)
  • 静态电流(Iq):20µA(低功耗待机)
  • 开关管:内部集成(简化外部布局)
  • 通道数:单通道,降压拓扑
  • 封装:SOT-563(超小型,适合便携设备)

三、电气与功能要点

  • 高频率工作(2.4MHz)使得可选电感、电容体积显著减小,有利于小尺寸电源模块设计。
  • 低静态电流使其非常适合电池供电或待机功耗要求严格的系统,比如便携、穿戴、物联网终端。
  • 内置同步整流与开关管提升转换效率,尤其在中高负载下效率优势明显。
  • 输出可调覆盖 0.6V 起,能够驱动低压核心电路或为多种子系统提供稳压源。
  • 器件通常具备常见保护功能(过流限制、短路保护、热关断等),增强系统可靠性(具体保护特性请参考 TI 的完整数据手册)。

四、典型应用场景

  • 智能手机附件、可穿戴设备和运动传感器
  • 低功耗物联网节点与无线传感器
  • 电池供电的嵌入式模块与便携式测量仪器
  • 工业控制小功率模块与接口电源

五、应用与布局建议

  • 输入与输出电容尽量靠近芯片电源引脚布置,使用低 ESR 陶瓷电容以降低电压纹波与提升瞬态响应。
  • 开关节点走线应最短并远离敏感模拟信号,减小 EMI。
  • 选择电感时优先考虑低 DCR、额定电流高于预期最大输出的器件,以降低功耗并保证温升。由于 2.4MHz 高频,可选用小体积高频电感。
  • SOT-563 封装散热有限,须在 PCB 上设计散热铜箔(热沉/大面积接地铜皮)并通过过孔扩展至多层地平面以改善热散逸,确保工作结温小于 +125°C(TJ)。
  • 对 EMI 敏感应用建议添加输入滤波与布局屏蔽,并遵循 TI 推荐的参考布局示意图。

六、封装与选型建议

  • 封装:SOT-563(微型 6 引脚),适合空间受限场合。
  • 选型时请确认所需输出电压范围与最大输出电流(1A)匹配,并参考 TI 数据手册中的效率、热特性和外部元件推荐值。对于更高电流或不同输入范围的需求,可考虑 TI 系列中的其他型号。

七、总结

TPS62A01DRLR 以其宽输入、可调输出、低静态电流与 2.4MHz 高开关频率的组合,适合对体积、效率与待机功耗有严格要求的电池供电系统。采用小型 SOT-563 封装非常适合空间受限的终端产品。在设计时建议参考 TI 的典型应用电路与 PCB 布局指南,选择合适的外部电感与低 ESR 电容以获得最佳性能与可靠性。若需完整电气参数与典型性能曲线,请参考德州仪器官方数据手册和应用笔记。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.