WMSIC Electronic Components

TI SN74LVC3G04DCUR

ModelSN74LVC3G04DCUR
PackageVSSOP-8
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) SN74LVC3G04DCUR
Type
TI
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
SN74LVC3G04DCUR
Electronic Component
1
Package
VSSOP-8
Electronic Component
Inverter
Electronic Component
74LVC
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0162842510
Operating Temperature
40℃~+125℃
Operating Voltage
1.65V~5.5V
Current(IOH)
32mA
Current(IOL)
32mA
Static Current(Iq)
10uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:SN74LVC3G04DCUR

基本信息

SN74LVC3G04DCUR是由德州仪器(TI)生产的一款高性能反相器,具有3路独立电路,适用于多种数字电路应用。该器件的工作电压范围广泛,从1.65V到5.5V,使其可以在低电压和高电压环境中灵活应用。

逻辑特性

作为一种反相器,SN74LVC3G04DCUR能够将输入逻辑信号反转。其输入逻辑电平的低端范围为0.7V至0.8V,而高端逻辑电平则在1.7V至2V之间。这一特性使得该器件适合与TTL和CMOS逻辑电平兼容的应用,为系统提供可靠的信号反转。

电气特性

SN74LVC3G04DCUR具有极低的静态电流消耗,仅为10µA(最大值),这使其在待机状态下非常节能,适合于便携式和电池供电的设备。情境下,输出电流能力达到32mA,能够支持大多数负载应用。此外,该器件在不同输入电压下具有优越的延迟性能,其最大传播延迟为3.2ns,针对50pF的负载,这对于高频数字电路中的高速信号传输是非常重要的。

工作温度

该反相器的工作温度范围为-40°C到125°C,这使得它在严苛环境中依然表现出色,适合于工业、汽车和消费电子等需在极端条件下运行的应用。

封装和安装

SN74LVC3G04DCUR采用8-VSSOP封装(Very Thin Shrink Small Outline Package),这种表面贴装型封装具有较小的尺寸和较轻的重量,有利于降低电路板的空间占用,并提高组装效率。其封装尺寸为0.091英寸(2.30mm宽),使得该部件适用于空间受限的应用场景。

应用领域

SN74LVC3G04DCUR广泛应用于多种电子系统与设备中,包括:

  • 消费电子产品(如手机、平板电脑等)
  • 计算机和外围设备
  • 工业控制和自动化系统
  • 汽车电子(如传感器和控制模块)
  • 通信设备(如路由器和信号放大器)

总结

综上所述,SN74LVC3G04DCUR是一款功能强大的反相器,具备低功耗、高速响应和广泛的工作电压范围,能够满足当今电子产品对小型化、低功耗和高性能的需求。采用VSSOP封装的设计使其便于集成至现代电子电路中,是设计工程师在数字逻辑应用中的理想选择。凭借其卓越的性能与可靠性,SN74LVC3G04DCUR帮助开发人员构建出高效的电子解决方案,推动着技术的进步与创新。

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