WMSIC Electronic Components

TI TLV9002IDGKR

ModelTLV9002IDGKR
PackageVSSOP-8
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) TLV9002IDGKR
Type
TI
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
TLV9002IDGKR
Electronic Component
1
Package
VSSOP-8
Electronic Component
Operational Amplifier
Electronic Component
0.138g
Electronic Component
1
Electronic Component
Output
Features
EMI / RF
Electronic Component
BM0228718763
Operating Temperature
40℃~+125℃
Amplifier
2
Output Current
40mA
(SR)
2V/us

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TLV9002IDGKR 产品概述

一、产品简介

TLV9002IDGKR 是 TI(德州仪器)推出的一款双路低功耗精密运算放大器,定位于电池供电及便携式应用。器件具备轨到轨输入与输出、低输入偏置和较低噪声等特点,适合对功耗与精度都有要求的模拟前端设计。

二、主要性能亮点

  • 共模抑制比(CMRR):86 dB(典型),保证差分误差抑制性能。
  • 噪声密度(eN):4.7 nV/√Hz @1 kHz,适合低噪声需求的信号链。
  • 输入/输出:轨到轨输入与轨到轨输出,扩大了输入/输出摆幅,便于低压单电源系统直接驱动后端。
  • 工作电源:单电源 1.8 V ~ 5.5 V;器件在多种供电方案下均能稳定工作(文档给出双电源参考范围)。
  • 输入失调电压(Vos):典型 1.6 mV,温漂 600 nV/℃,适合精密直流测量。
  • 输入偏置电流(Ib):5 pA,输入失调电流(Ios):2 pA,利于高阻抗传感器接口。
  • 增益带宽积(GBP):1 MHz,压摆率(SR):2 V/µs,静态电流(Iq):60 µA(低功耗)。
  • 工作温度范围:-40 ℃ ~ +125 ℃,工业级可靠性。
  • 封装:VSSOP-8,便于中高密度封装应用。

三、典型应用场景

  • 便携式设备的传感器前端(温度、压力、光电探测等),因其低偏置电流和轨到轨特性,可直接与高阻抗传感器耦合。
  • 低功耗数据采集与缓冲(ADC 驱动、缓冲放大)。
  • 低频滤波器与精密放大器电路(直流精度要求中等且对噪声敏感)。
  • 需要在较宽温度范围工作的工业与仪器仪表。

四、设计注意事项

  • 由于 GBP 为 1 MHz 与 SR=2 V/µs,TLV9002 更适合低速至中速应用,不推荐用于高带宽或高速瞬态放大场合。
  • 对于极低噪声设计,应注意 PCB 布局与接地,缩短输入引线并采用良好旁路或屏蔽措施。
  • 输入偏置极低,但长时间漂移或漏电路径会影响精度,建议使用良好绝缘与清洁工艺。
  • 电源去耦:在靠近器件处用低 ESR 电容做局部去耦,改善瞬态响应与抑制供电噪声。

五、封装与订购信息

TLV9002IDGKR 为 TI 原装 VSSOP-8 封装,双路器件,适合空间受限但需要引脚完整性的电路板。订购与进一步规格请参阅 TI 官方数据手册和应用说明,以获取最新器件参数、引脚图和评估板参考电路。

总结:TLV9002IDGKR 以低功耗、轨到轨 I/O、低偏置电流和良好直流精度为主要优势,是电池供电与高阻抗传感器接口的理想选择,在低频精密模拟前端中具有很好的性价比和应用灵活性。

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