Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TLV431BIDBZR 是德州仪器(TI)推出的一款可调并联(基准型并联稳压器)电压基准芯片,封装为 SOT-23-3。关键参数如下:
TLV431B 系列以低静态电流、高精度和宽温度范围为特点,适合对功耗和精度都有较高要求的系统。典型优势包括:低待机电流适合电池供电设备;高精度(±0.5%)利于对精密参考电压要求的模拟或数模混合电路;可调输出允许灵活设置多档参考电压或精密比较基准。
TLV431B 作可调基准器时,通常通过外部两个电阻构成反馈分压,设置所需输出电压。常用计算公式: VOUT = VREF × (1 + R1 / R2) + IREF × R1 其中 VREF 为内部基准(名义 1.24 V),IREF 为参考针脚偏置电流(通常很小,可在大多数设计中忽略)。在设计时应确保分流电流(流过芯片阴极的电流)在 100 μA 至 15 mA 之间,以维持稳压并满足线性与精度规范。
SOT-23-3 小封装便于空间受限的应用,但作为并联分流器件需要关注功耗与热耗散。实际使用时需计算:功耗 P = (VIN - VOUT) × IK(其中 IK 为分流电流),并验证封装的热阻和电路板散热能力,避免过热导致漂移或失效。
总结:TLV431BIDBZR 以其低静态电流、0.5% 精度和可调输出(1.24 V~6 V)在便携、工业与精密测量等多种场景中具有良好适应性,合理的电流、热与外部电阻设计可发挥其最佳性能。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products