WMSIC Electronic Components

TI SN74LVC2G08DCUR

ModelSN74LVC2G08DCUR
PackageVSSOP-8-0.5mm
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) SN74LVC2G08DCUR
Type
TI
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
SN74LVC2G08DCUR
Electronic Component
1
Package
VSSOP-8-0.5mm
Electronic Component
Logic Gate
Electronic Component
74LVC
Electronic Component
0.034g
Electronic Component
1
Channel Count
2
Features
Driver
Electronic Component
BM69417653
Operating Temperature
40℃~+125℃
Operating Voltage
1.65V~5.5V
Logic Type
and Gate

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN74LVC2G08DCUR 产品概述

一、产品简介

SN74LVC2G08DCUR 是德州仪器(Texas Instruments, TI)出品的一款高性能的 CMOS 与门逻辑集成电路,采用8-VSSOP封装,专为满足广泛的逻辑电路需求设计。该产品具备较小的封装尺寸和优秀的电气性能,适用于各种高频及低功耗的数字电路应用。

二、主要特点

  1. 双通道与门:SN74LVC2G08DCUR 提供两个独立的与门通道,适合在多种逻辑设计中进行组合和使用,提升了设计灵活性。

  2. 宽电压供电范围:该集成电路支持1.65V至5.5V的供电电压范围,能够适应不同电压要求的应用,有效增加了与其它逻辑电路的兼容性。

  3. 快速传播延迟:在5V供电且负载电容为50pF时,最大传播延迟仅为3.8ns,使其在高速数字信号处理中的表现尤为出色,适合高频操作场景。

  4. 低功耗特性:静态电流最大仅为10µA,保证了在低功耗设计中的应用,特别是在电池供电的设备中表现优越。

  5. 工作温度范围:该组件能够在-40°C到125°C的温度范围内稳定工作,保证了在极端环境下的可靠性,适用于工业、汽车和航空航天等领域。

  6. 输出电流能力:其输出电流能力达到32mA,支持驱动多个负载,确保在实际应用中的高效表现。

  7. 逻辑电平范围:逻辑高电平为1.7V至2V,逻辑低电平为0.7V至0.8V,确保在TTL和CMOS逻辑电路中进行可靠的逻辑判断。

三、应用场合

SN74LVC2G08DCUR 适用于广泛的应用领域,包括但不限于:

  • 嵌入式系统:在各种微控制器或微处理器中作为逻辑电路的基础组成部分。
  • 消费者电子产品:如手机、平板和其他智能设备中的数字逻辑处理。
  • 工业控制:作为控制信号的逻辑处理单元,适用于机器人、传感器和执行器等。
  • 汽车电子:在汽车内部逻辑系统中实现多功能控制,如灯光、引擎管理和通讯系统。
  • 医疗设备:对高可靠性和准确性的要求,符合医疗电子产品的严格标准。

四、总结

SN74LVC2G08DCUR 代表了TI在CMOS与门逻辑集成电路领域的先进技术,其出色的电气性能、低功耗及宽温工作范围使之成为高效逻辑设计的理想选择。无论是在复杂的嵌入式系统还是在简单的数字电路中,SN74LVC2G08DCUR 都能够提供稳定可靠的解决方案。随着电子设备向着更高集成度和更低功耗发展,该产品将是设计师的一个重要工具。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.