WMSIC Electronic Components

TI LM324BIDR

ModelLM324BIDR
PackageSOIC-14
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TI(Texas Instruments) LM324BIDR
Type
TI
Minimum package
3000

Technical parameters

Electronic Component
CUT TAPE
Electronic Component
TI(Texas Instruments)
Electronic Component
LM324BIDR
Electronic Component
1
Package
SOIC-14
Electronic Component
Operational Amplifier
Electronic Component
0.52g
Electronic Component
1
Electronic Component
BM0263516481
Operating Temperature
40℃~+85℃
Amplifier
4
Output Current
20mA
(SR)
500V/ms
Power Supply Voltage
3V~36V
Static Current(Iq)
240uA
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM324BIDR — 德州仪器四路运放产品概述

一、产品简介

LM324BIDR 是德州仪器(TI)推出的一款四路通用型运算放大器,封装为 SOIC-14,适用于宽电源范围和低功耗系统。该器件具备稳定的直流性能和较低的噪声特性,适合传感器接口、信号调理及一般模拟前端电路。

二、主要规格(典型/代表值)

  • 放大器数:4(Quad)
  • 增益带宽积(GBW):1.2 MHz
  • 输入失调电压(Vos):约 600 µV
  • 输入失调电压温漂(Vos TC):7 µV/℃
  • 压摆率(SR):500 V/ms(0.5 V/µs)
  • 输入偏置电流(Ib):10 nA
  • 输入失调电流(Ios):500 pA
  • 输入电压噪声密度(eN):35 nV/√Hz @ 1 kHz
  • 共模抑制比(CMRR):80 dB
  • 静态电流(Iq):240 µA(每放大器,典型)
  • 输出电流:20 mA
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 电源电压范围:单电源 3 V ~ 36 V;对称双电源可支持 ±2.5 V ~ ±18 V
  • 封装:SOIC-14
  • 品牌:TI(德州仪器)

三、性能特点与优势

  • 低输入失调电压与小温漂,便于精确直流放大与零点校准,减少外部修正电路需求。
  • 适中的 GBW 与压摆率,使其在低频到中频的增益放大、滤波和缓冲应用中表现良好。
  • 较低的静态电流(每通道约 240 µA),适合电池供电或低功耗系统。
  • 宽电源电压范围支持从低电压便携设备到较高电压工业系统的应用。
  • 每路可驱动高达 20 mA 的负载,满足常见模拟负载驱动需求。

四、典型应用场景

  • 传感器信号调理(温度、压力、应变计等)
  • 低频主动滤波器与有源滤波电路
  • 仪表放大器前端(需配合差分电路)
  • 音频前级与缓冲(中低频段)
  • 工业控制与模拟开关驱动
  • 电池供电信号处理与便携设备

五、设计建议与注意事项

  • 若需要更高带宽或更快的压摆率,应选用更高速的运放;本器件更适合低至中频带宽需求的场合。
  • 对于高精度直流测量,虽然 Vos 较低仍建议在关键测量通道做失调校正或配对匹配。
  • 在驱动大容性负载或长电缆时需注意稳定性,建议加阻尼或输出保护网络。
  • 电源旁路(去耦)对抑制干扰和保证低噪声性能至关重要,推荐在每个电源引脚近距离并联陶瓷电容与电解电容。
  • 考虑到工作温度范围,关键应用在极端温度下应验证器件的偏移和漂移特性。

六、封装与订购信息

  • 型号:LM324BIDR
  • 封装:SOIC-14(工业级)
  • 购买建议:选型时请以德州仪器官方数据手册为准,核对批次和温度等级以满足设计要求。

如需针对特定应用(例如差分放大、滤波器设计或低噪声传感器接口)提供参考电路和元件选型建议,可说明应用场景,我将提供更具体的设计方案。

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