WMSIC Electronic Components

TI SN74HC4066PWR

ModelSN74HC4066PWR
PackageTSSOP-14
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TI(Texas Instruments) SN74HC4066PWR
Type
TI
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
SN74HC4066PWR
Electronic Component
1
Package
TSSOP-14
Electronic Component
30MHz
Electronic Component
Analog Switch / Multiplexer
Electronic Component
0.11g
Electronic Component
1
Channel Count
4
Features
Analog
Electronic Component
BM0226511175
Operating Temperature
40℃~+85℃
Operating Voltage
2V~6V
Switch
1:1
(tpd)
10ns

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN74HC4066PWR 产品概述

一、器件简介

SN74HC4066PWR 为德州仪器(TI)出品的高性能 CMOS 模拟开关/多路复用器,封装为 TSSOP-14。器件内部实现四路独立的双向模拟开关,适用于在 2V 至 6V 电源范围内对模拟或数字信号进行选择、切换和透传。工作温度范围为 -40℃ 至 +85℃,适合工业级和商业级应用。

二、主要参数(基础指标)

  • 工作电压:2V ~ 6V
  • 工作温度:-40℃ ~ +85℃
  • 开关电路:1:1(四路独立单刀单掷双向开关架构)
  • 导通电阻 Ron:50Ω(典型)
  • 带宽:30MHz(典型)
  • 导通时间 ton:18ns
  • 关闭时间 toff:22ns
  • 传播延迟 tpd:10ns
  • 封装:TSSOP-14(SN74HC4066PWR)

以上数据为典型/参考值,实际设计时应参考器件数据手册中的典型值与最大值。

三、功能与性能解读

SN74HC4066 属 HC 系列 CMOS 模拟开关,支持双向信号传输;当对应使能端为高电平时,相应开关闭合,信号在两个端点间低损耗传输;使能端为低电平时断开。50Ω 的导通电阻意味着在低阻抗信号源或高速要求场合需考虑衰减与串联滤波效应;30MHz 的带宽和数十纳秒级的开关时间使其适合中等速率的模拟或数字时分复用、音频信号切换、测试测量中的通道隔离等场景。

四、典型应用场景

  • 模拟信号多路复用:传感器采集通道切换、信号路由。
  • 音频/视频切换:音频通路选择、低速视频或复合视频信号切换(注意带宽限制)。
  • 数模切换与采样:与 ADC/DAC 配合做前端通道选择或采样保持切换。
  • 自动测试设备(ATE):被测回路的通断控制、信号注入与测量。
  • 电平隔离与低速信号路由。

五、设计与布局建议

  • 信号幅度应限制在 VCC 与 GND 之间,避免输入超出电源轨产生电流沿或损坏。
  • Ron 对信号带来的频率响应影响不可忽视,系统带宽可近似受 RC 截止频率限制:fc ≈ 1/(2π·Ron·Cload)。例如在 50Ω 决定下,较大的负载电容会显著降低高频响应。
  • 对高速或精密模拟应用,考虑使用低 Ron 或专用射频开关替代。
  • TSSOP-14 封装在 PCB 布局时注意地平面连续性和去耦电容靠近器件电源引脚,减少开关瞬态干扰。
  • 控制端为 CMOS 兼容逻辑,驱动时注意上升/下降沿引入的开关毛刺,必要时在控制线上加去抖或缓冲。

六、常见注意事项与替代器件

  • Ron 会随温度与 VCC 变化;高精度测量场合应在数据手册中查取在目标电压/温度下的典型值与最大值。
  • 若需要更低的导通电阻或更高带宽,可考虑专用模拟开关或微波开关系列;若在更窄工作电压或更严格失真要求下,也可选用专门音频开关或低失真模拟开关。
  • 使用时务必参照 TI 官方数据手册和应用笔记,检查功耗、热限与 ESD 防护要求。

七、总结

SN74HC4066PWR 以其四路独立双向开关结构、宽电源范围(2V~6V)、中等导通电阻(50Ω)及纳秒级开关速度,适合多种中低频模拟与数字信号切换应用。设计时需综合考虑 Ron 对频响和信号完整性的影响,合理布线与去耦,以确保在 TSSOP-14 封装下实现可靠稳定的开关性能。若有更高带宽或更低失真的要求,可在系统级做权衡或选型替代器件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.