WMSIC Electronic Components

TI TMP302ADRLR

ModelTMP302ADRLR
PackageSOT-563
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TI(Texas Instruments) TMP302ADRLR
Type
TI
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
TMP302ADRLR
Electronic Component
1
Package
SOT-563
Type
Electronic Component
Electronic Component
Thermal Switch
Electronic Component
0.046g
Electronic Component
1
Electronic Component
65℃
Electronic Component
BM0238656608
Operating Voltage
1.4V~3.6V
Operating Current
15uA
Static Current(Iq)
15uA
Electronic Component
±0.2℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMP302ADRLR — 温控开关产品概述

一、产品简介

TMP302ADRLR 是德州仪器(TI)推出的一款半导体式温控开关,采用超小型 SOT-563 封装,面向对体积、功耗和温度精度有严格要求的便携与嵌入式应用。器件提供可编程动作温度范围 50℃~65℃(出厂默认动作温度 65℃),动作温度精度高达 ±0.2℃,适合精密温度门限控制。

二、主要性能亮点

  • 类型:半导体式温控开关
  • 可编程动作温度:50℃~65℃(可配置)
  • 默认动作温度:65℃
  • 温度迟滞(去抖):可配置为 10℃ 或 5℃,用于防止输出抖动
  • 动作温度精度:±0.2℃,满足高精度门限要求
  • 工作电压:1.4 V ~ 3.6 V,支持多种电池供电和低压系统
  • 工作/静态电流 Iq:15 μA(超低功耗,适合电池供电场景)
  • 封装:SOT-563(超小封装,便于高密度 PCB 布局)

三、典型应用场景

  • 电池管理系统(BMS)中的温度门限与保护
  • 移动设备与穿戴产品的过温保护与散热控制
  • 物联网终端、无线传感器节点的温控报警
  • 通信设备、电源模块的过温关断与风扇控制
  • 家电或工业控制中对温度上限的精确监测与动作控制

四、设计与使用建议

  • 低压供电:器件支持 1.4~3.6V,适用于单节至双节锂电池直供或 3.3V 系统;在不同电压下工作电流稳定,利于低功耗设计。
  • 封装与热耦合:SOT-563 封装体积小,热容低;为保证测温准确,应合理安排器件与被测点的热耦合,避免自热或远端热源干扰。
  • 迟滞设置:根据系统对开关频繁切换的敏感性选择 5℃ 或 10℃ 迟滞值;较大迟滞有助于减少控制器抖动,但会增加温差范围。
  • EMC 与滤波:在有高速开关或强电磁干扰的系统中,加装合适的旁路电容和滤波措施,确保稳定触发。
  • 校准与验证:尽管器件精度高(±0.2℃),在关键应用中仍建议经过系统级的读数校准与环境验证,考虑装配偏差与热阻影响。
  • 参考资料:具体引脚定义、输出类型和电气时序请参考 TI 官方数据手册与应用说明以获得完整设计信息。

五、封装与采购信息

TMP302ADRLR 提供 SOT-563 封装,适用于自动贴装生产,节省 PCB 面积。有关包装形式、最小订货量及产能信息建议联系 TI 授权分销商或访问 TI 官方网站以获取最新供应状态与报价。

总结:TMP302ADRLR 以其高精度(±0.2℃)、低功耗(15 μA)与小尺寸(SOT-563)组合,适合需要精确温控门限且受空间和电源约束的各类应用。在设计时注意热耦合与迟滞设置,可发挥其最佳性能。

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