WMSIC Electronic Components

TI UCC27324DGNR

ModelUCC27324DGNR
PackageHVSSOP-8-EP-0.65mm
BrandTI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TI(Texas Instruments) UCC27324DGNR
Type
TI
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TI(Texas Instruments)
Electronic Component
UCC27324DGNR
Electronic Component
1
Package
HVSSOP-8-EP-0.65mm
Electronic Component
Gate Driver IC
Electronic Component
0.062g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0228533863
Operating Temperature
40℃~+125℃
Operating Voltage
4.5V~15V
Load Type
MOSFET
Driver
Electronic Component
Current(IOH)
4.8A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

UCC27324DGNR 产品概述

一、概述与主要参数

UCC27324DGNR 是 TI(德州仪器)出品的双通道低边 MOSFET 栅极驱动器,专为高速、大电流开关场景设计。主要参数包括:双通道输出、低边驱动配置;灌电流 IOL 4.5A、拉电流 IOH 4.8A;工作电压范围 VCC 4.5V~15V;典型上升时间 tr ≈ 20ns、下降时间 tf ≈ 15ns;工作温度范围 -40℃~+125℃;封装为 HVSSOP-8 带外露焊盘(EP,0.65mm 引脚间距)。

二、关键特性与优势

  • 大峰值驱动电流(≈4.5A/4.8A)能快速给大栅电容 MOSFET 充放电,缩短开关瞬态,降低开关损耗。
  • 宽 VCC 范围适配常见门极电源(5V、10V、12V)要求,提高系统灵活性。
  • 快速 tr/tf 有利于在高频转换(开关电源、同步整流等)中降低切换损耗,但需注意抑制寄生振荡。
  • HVSSOP-8-EP 封装便于 PCB 散热与地平面连接,提升热性能与可靠性。

三、典型应用场景

  • 同步降压转换器中的低边 MOSFET 驱动;
  • 电机驱动与半桥/全桥功率级低边驱动;
  • 开关电源、DC–DC 转换器的高频功率开关;
  • 同步整流、功率管理与电源模块。

四、设计与布局要点

  • VCC 旁放置高频旁路电容(例如 0.1µF 陶瓷)与 1µF~4.7µF 的电解/陶瓷组合电容,尽量靠近芯片 VCC 与 GND 引脚焊盘。
  • 输出到 MOSFET 门极之间建议并联合适的串联栅阻,控制 di/dt 和抑制振铃;常见取值从几欧到几十欧,依据栅电容与系统容抗调整。
  • 外露焊盘(EP)必须焊接至大铜面积地平面以提高散热并保证低阻抗返回。信号走线短且粗,尽量避免长回流路径。
  • 如负载存在大感性并发电压尖峰,考虑在电源端增加 TVS 或 RC 吸收网络保护驱动器。

五、热管理与可靠性

  • 在高开关频率或连续大电流切换时,器件结温可能升高,应通过 PCB 铜厚、外露焊盘散热以及适当的降额设计控制结温。
  • 工作环境温度覆盖 -40℃~+125℃,但为保证长期可靠性建议在系统热仿真后确认实际结温并留有裕量。

六、选型建议

  • 若需更高驱动电流或更高/更低工作电压,可在同类产品中比较峰值电流、延时、封装散热能力与输入兼容性;在板级设计中优先保证电源净化与回流布局,以发挥 UCC27324 的高速大电流优势。

如需电路例图、栅阻选型计算或 PCB 布局示意,可提供工作条件与目标 MOSFET 型号,我可据此给出更具体建议。

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