Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TI SN74HC594DR
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TI(Texas Instruments) SN74HC594DR
- Type
- TI
- Unit
- Electronic Component
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- to
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TI(Texas Instruments)
- Electronic Component
- SN74HC594DR
- Electronic Component
- 1
- Package
- SOIC-16
- Electronic Component
- positions Register
- Electronic Component
- 74HC
- Electronic Component
- 0.296g
- Electronic Component
- 1
- Electronic Component
- 1
- Features
- Electronic Component
- Electronic Component
- BM0045273918
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 2V~6V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SN74HC594DR 产品概述
SN74HC594DR 是由德州仪器（Texas Instruments, TI）生产的一款高性能串行至并行移位寄存器。这款移位寄存器以其强大的功能和灵活性，在多种数字电路应用中扮演了重要角色。它采用了标准的16引脚SOIC封装，适合于表面贴装技术，易于集成到现代电子设备中。
主要特性
逻辑类型和位数： SN74HC594DR 是一款8位的移位寄存器，能够进行串行输入和并行输出。这使得它极为适合于需要将串行数据转换为并行数据的应用场景，广泛用于数据采集、显示控制和信号处理等领域。
输出类型： 该器件采用推挽式输出配置，这能够有效提高输出驱动能力，并保证快速的信号转换速度。这一特性对于高速数据传输尤其重要，确保了信号的完整性和传输效率。
电源电压： SN74HC594DR 的供电电压范围为2V至6V，适应了多种逻辑电平要求，可以与低电压和高电压的系统兼容。这使得它在不同电源环境中均能稳定工作，且具有较高的灵活性。
工作温度范围： 此器件的工作温度范围广泛，支持-40°C到85°C的环境温度，适应了工业、汽车和消费电子等各种应用场合。其优异的耐温性能使得SN74HC594DR能够在严苛的环境中稳定运行。
便利的封装设计： 作为16-SOIC封装的器件，SN74HC594DR 适合于表面贴装，尺寸紧凑，可节省电路板空间。同时，SOIC封装还为高密度布局提供了便利，易于实现高效的PCB设计。
应用领域
SN74HC594DR 的应用场景非常广泛，尤其是在以下几个领域表现出色：
数据转换：将串行数据很方便地转换为并行输出，使得它能在需要实时数据处理的设备中发挥重要作用。
LED驱动：应该能够通过并行输出控制多个LED，实现复杂的显示效果，这是其在消费电子中的重要应用之一。
微控制器和处理器陪伴设备：在微控制器项目中，SN74HC594DR 可以帮助扩展数字输入/输出接口，使得系统设计更加灵活。
接口扩展：在具有较少IO口的微处理器中，使用此移位寄存器可有效扩展输出能力，满足更多设备的连接需求。
设计优势
选择SN74HC594DR 的设计优势在于其高效的性能、安全性和广泛的应用兼容性。它的输出特性和电源灵活性，使得设计者能够在不同的电保环境下，自由选择所需的电源和系统架构。加上其坚固的温度适应性，能够满足高要求现场的使用需求。
结论
综上所述，SN74HC594DR 是一款功能强大的串行至并行移位寄存器，凭借其优异的电气特性、广泛的应用场景和便于集成的封装，成为现代数字电路设计中不可或缺的关键器件。无论是在工控、汽车还是消费电子领域，它都充当着连接与数据处理的桥梁，推动着电子技术的进步与发展。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
