WMSIC Electronic Components

DF3A5.6LFV(TPL3,Z) DF3A5.6LFV

ModelDF3A5.6LFV(TPL3,Z)
PackageVESM
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA DF3A5.6LFV(TPL3, Z)
Type
TOSHIBA
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
DF3A5.6LFV(TPL3,Z)
Electronic Component
1
Package
VESM
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
8pF
Electronic Component
BM0258688303
Electronic Component
IEC 61000-4-2
Current(Ir)
1uA
Voltage(VBR)
5.3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DF3A5.6LFV(TPL3,Z) 产品概述

概要

DF3A5.6LFV(TPL3,Z) 是由东芝(TOSHIBA)生产的一款静电和浪涌保护(TVS/ESD)齐纳二极管,专门设计用于保护电子设备免受静电放电(ESD)和瞬态浪涌电压的影响。以下是对此产品的详细介绍。

基础参数

  • 类型: 齐纳二极管
  • 单向通道: 2
  • 电压 - 反向断态(典型值): 3.5V
  • 电压 - 击穿(最小值): 5.3V
  • 电源线路保护: 无
  • 应用: 通用
  • 不同频率时电容: 8pF @ 1MHz
  • 安装类型: 表面贴装型
  • 封装/外壳: SOT-723
  • 供应商器件封装: VESM

描述

DF3A5.6LFV(TPL3,Z) 齐纳二极管主要用于提供高效的静电和浪涌保护,确保电子设备在受到意外的高电压冲击时能够保持正常运行。其小型化的SOT-723封装使其非常适合于现代电子产品中的空间有限的设计。

特点

静电和浪涌保护

该器件能够有效地吸收和分散静电放电和瞬态浪涌电压,保护敏感的电子元器件免受损害。其低电容特性(8pF @ 1MHz)使其在高频应用中尤为适用。

小型化封装

采用SOT-723封装,DF3A5.6LFV(TPL3,Z) 具有极小的体积,这使得它可以轻松集成到各种紧凑的电子设备中,如智能手机、平板电脑、汽车电子系统等。

高可靠性

东芝作为一家知名的半导体制造商,DF3A5.6LFV(TPL3,Z) 齐纳二极管经过严格的测试和验证,确保其在各种环境条件下都能提供可靠的性能。

通用应用

该器件适用于广泛的应用场景,包括但不限于消费电子、工业控制、汽车电子、医疗设备等领域。其通用性使得它成为许多设计工程师的首选。

技术参数详解

  • 反向断态电压(典型值): 3.5V,这表示在正常工作状态下,器件能够承受的最大反向电压。
  • 击穿电压(最小值): 5.3V,这是指当器件开始导通并开始吸收过载电压时的最低电压阈值。
  • 电容: 在1MHz频率下,器件的电容为8pF,这对于需要保持信号完整性的高频应用非常重要。

安装和使用建议

  • 表面贴装: 由于采用SOT-723封装,DF3A5.6LFV(TPL3,Z) 适合于自动化表面贴装生产线。
  • 布局设计: 在PCB设计中,应确保器件与需要保护的敏感元器件之间的距离尽可能短,以最大限度地减少传导路径中的寄生参数。
  • 热设计: 考虑到器件可能会在吸收过载电压时产生热量,应确保PCB布局允许良好的热散热。

结论

DF3A5.6LFV(TPL3,Z) 是一款高性能、紧凑型的静电和浪涌保护齐纳二极管,通过其出色的保护能力和小型化设计,能够满足现代电子产品对可靠性和空间效率的要求。它是各类电子设备设计工程师的理想选择,能够帮助他们构建更加robust和可靠的系统。

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