WMSIC Electronic Components

2SA1163-BL,LF(T 2SA1163

Model2SA1163-BL,LF(T
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA 2SA1163-BL, LF(T
Type
TOSHIBA
Minimum package
3000

Technical parameters

Electronic Component
TOSHIBA
Electronic Component
2SA1163-BL,LF(T
Electronic Component
1
Electronic Component
Transistor(BJT)
Electronic Component
0g
Electronic Component
1
Power(Pd)
200mW
Electronic Component
Transistor(BJT)
Electronic Component
BM0262576136
Operating Temperature
55℃~+150℃
Transistor Type
PNP
Frequency(f T)
100MHz
Electronic Component
3000
Collector Current(Ic)
100mA
Collector-Emitter Breakdown Voltage(Vceo)
120V
Collector Current(Icbo)
100nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2SA1163-BL,LF(T) 产品概述

一、产品概况

2SA1163-BL,LF(T) 是东芝(TOSHIBA)推出的一款小功率 PNP 双极型晶体管,面向便携和小信号放大应用。该器件具有高电压承受能力与较高的静态电流增益,适用于需要低电流驱动但要求较大耐压的电路场合。其典型参数包括:最大耗散功率 Pd = 200 mW,集电极-发射极击穿电压 Vceo = 120 V,最大集电极电流 Ic = 100 mA,特征频率 fT = 100 MHz。

二、主要电气性能与特性

  • 晶体管类型:PNP 小信号三极管(BJT)
  • 功耗:Pd = 200 mW(环境与贴片条件影响功耗,实际使用请按散热条件做降额)
  • 耐压:Vceo = 120 V,适合较高电压工作环境
  • 最大集电极电流:Ic = 100 mA(短时间峰值能力需参考器件热和安规限制)
  • 直流电流增益:hFE = 200(在 Ic = 2 mA、Vce = 6 V 条件下测得),低电流时增益表现优良
  • 特征频率:fT ≈ 100 MHz,适合高频小信号放大及快速开关用途
  • 集电极截止电流:Icbo ≈ 100 nA(典型,说明在高压偏置下漏电流较小)
  • 饱和电压:VCE(sat) ≈ 300 mV(在 Ic = 10 mA、Ib = 1 mA 条件下),表现为低饱和损耗
  • 工作温度范围:-55 ℃ 至 +150 ℃

三、封装与机械信息

该型号以 SC-59 小型封装提供,体积小、适合高密度 PCB 布局和便携式设备。SC-59 具有良好的焊接性与机械强度,但具体引脚排列与封装外形请以东芝原厂数据手册为准,设计时应核对脚位图和焊盘推荐尺寸以确保可靠焊接。

四、典型应用场景

  • 小信号放大器与前置放大级(低电流、高增益场合)
  • 高压小电流开关与电平转换电路
  • 电流镜与偏置源(利用高 hFE 在小电流下获得稳定偏置)
  • 消费类电子、仪表和工业控制中的驱动/接口电路
  • 高频低功耗放大或缓冲级(得益于 100 MHz 的 fT)

五、设计与使用建议

  • 功率与热管理:器件额定 Pd = 200 mW 为在规定散热条件下的最大耗散值;实际应用中应根据工作环境温度对功耗进行线性降额,并避免持续在额定功耗附近运行以延长寿命。
  • 安全工作区:尽管 Vceo 高达 120 V,但在大电压与大电流同时出现时会受热限制,建议遵守器件安全工作区(SOA)并参考数据手册典型曲线。
  • 偏置与稳定性:在放大电路中,宜在设计偏置网络时考虑温漂和 hFE 的分散;必要时加入负反馈或温度补偿元件。
  • 焊接与工艺:遵循东芝推荐的回流焊工艺参数与静电防护规范,避免过高的峰值回流温度或过长加热时间造成封装或性能劣化。
  • 引脚与封装核对:不同生产批次或类似型号封装可能存在轻微差异,设计前请确认原厂数据表的引脚定义与机械图。

六、选型建议与替代思路

选择 2SA1163-BL,LF(T) 时,若系统要求为:高耐压(≈120 V)、低功耗、小尺寸且在低电流下要求高增益,则该器件是合适选择。若需要更高功率或更大电流能力,应考虑功率更高的封装或同类高耐压 PNP 器件;若需要更高频率性能,可筛选 fT 更高的射频型晶体管。对于直接替换,请优先匹配关键参数:Vceo、Ic、hFE(在目标工作电流点)和封装形状,并参考原厂数据手册确认引脚与热特性。

若需器件原厂数据手册(Datasheet)、封装尺寸图或批量采购信息,请联系东芝官方渠道或授权分销商获取最新且完整的技术资料。

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