WMSIC Electronic Components

1SS352(TPH3,F) 1SS352

Model1SS352(TPH3,F)
PackageUSC
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA 1SS352(TPH3, F)
Type
TOSHIBA
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
1SS352(TPH3,F)
Electronic Component
1
Package
USC
Electronic Component
Schottky Diode
Electronic Component
0.026g
Electronic Component
1
Electronic Component
BM0257330061
Current
100mA
Diode
1
Current(Ir)
500nA@80V
(Vf)
1.2V@100mA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
80V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SS352 (TPH3,F) 肖特基二极管 产品概述

一、主要特性

1SS352 是东芝(TOSHIBA)推出的一款低正向压降肖特基整流二极管,主要面向便携式与高频开关电源等需要低损耗的小电流整流场合。器件具有低正向电压、低反向泄漏以及较好的浪涌承受能力,适合对效率和热耗敏感的电路设计。

二、关键电气参数

  • 正向压降 (Vf):约 1.2 V @ IF = 100 mA
  • 直流反向耐压 (Vr):80 V
  • 额定整流电流:100 mA(直流)
  • 反向电流 (Ir):典型 500 nA @ Vr = 80 V(常温标称值)
  • 非重复峰值浪涌电流 (Ifsm):1 A(单次浪涌能力)

三、封装与热特性

封装标识为 USC,属于微小外形封装,适合表面贴装(SMD/SMT)工艺。由于器件电流等级较小,功耗主要取决于正向压降与工作电流,布局时应注意散热路径及铜箔面积,以抑制结温上升和反向泄漏随温度增长的加剧。

四、典型应用场景

  • 小功率开关电源的二次侧整流或自由轮回路
  • 通信、便携设备的电源保护与极性保护
  • 高频整流、采样保持或快速恢复整流场合
  • 需要低正向压降以提高效率的便携式电子产品

五、设计与使用建议

  • 在设计中考虑 Vf 在 100 mA 时约 1.2 V 的功耗,及时进行热设计与结温(Tj)估算;长期工作建议降额使用以延长可靠性。
  • 反向泄漏随温度显著增大,系统若在高温下工作,应验证 Ir 对电路的影响,必要时选用并联或改用更高规格器件。
  • 峰值浪涌 Ifsm 为 1 A,可承受短时浪涌,但不宜作为长期过载条件。对于可能存在反复浪涌的应用,建议增加浪涌抑制或限流措施。
  • 封装微小,焊接与回流工艺应遵循厂商推荐曲线,防止过热损伤。贴装时尽量缩短走线、增大铜箔散热区域并避免热斑。

总结:1SS352(TPH3,F)以其低正向压降与高耐压(80 V)特性,适用于小电流、高效率与空间受限的整流与保护应用。设计时关注温度对漏电流与热耗的影响,并做好相应的热管理与浪涌保护,可获得稳定可靠的工作表现。

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