WMSIC Electronic Components

2SD2719(TE85L,F) 2SD2719

Model2SD2719(TE85L,F)
PackageTSM
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA 2SD2719(TE85L, F)
Type
TOSHIBA
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
2SD2719(TE85L,F)
Electronic Component
1
Package
TSM
Type
NPN
Electronic Component
Darlington Transistor
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0263440857
Power Dissipation(Pd)
800mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
800mA
Current (h FE)
2000
Voltage(Vebo)
8V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2SD2719 (TE85L,F) 产品概述

一、概述

2SD2719 是东芝(TOSHIBA)出品的一款 NPN 小信号/低功耗功率三极管(封装:TSM),型号后缀 TE85L,F。该器件以高直流电流增益为主要特性,适合用作前级放大、驱动级或一般开关场合。器件设计兼顾增益与耐压,适用于需要较大电流放大倍数但功耗有限的电路。

二、主要电气参数

  • 类型:NPN
  • 集射极击穿电压 Vceo:60 V
  • 最大集电极电流 Ic:800 mA
  • 最大耗散功率 Pd:800 mW
  • 集电极截止电流 Icbo:10 μA
  • 集—射极饱和电压 VCE(sat):典型 1.2 V / 1.5 V(视测试条件而定)
  • 直流电流增益 hFE:2000(标称,高增益条件下)
  • 射基极击穿电压 Vebo:8 V
  • 基极—发射极饱和电压 VBE(sat):2 V

以上参数为器件典型或极限值,实际设计中应参照器件详细数据手册的测试条件与曲线图进行验证。

三、特点与优势

  • 高电流增益:hFE 达到 2000,便于在极小基极电流条件下获得较大集电极电流,适合放大微弱信号或减少驱动功耗的场合。
  • 中等耐压能力:Vceo=60V,可在中低电压开关与放大电路中安全工作。
  • 适度功耗承受:Pd=800 mW,配合合适散热可以满足小功率驱动或放大需求。
  • 小封装(TSM):占板面积小,适合空间受限的电路板布局。

四、典型应用场景

  • 前置放大器与信号放大级:用于音频、小信号放大电路的电压或电流放大。
  • 中低功率开关与驱动:作为继电器、小型负载或场效应管的驱动级。
  • 电路保护与偏置网络:利用高增益特性在偏置电路中实现较小基流控制较大集流。

五、使用注意事项

  • 增益随工作点变化:标称 hFE=2000 常在特定测试电流下测得,随 Ic、Vce 与温度变化较大。在接近 Ic 最大值时增益通常会下降,应在电路中留有裕量并测试实际增益曲线。
  • 饱和电压与开关损耗:VCE(sat) 在 1.2–1.5 V,开关使用时会产生较大的压降与损耗,若需低饱和电压开关应考虑低 VCE(sat) 专用器件或并联方案。
  • 基极反向击穿:Vebo=8V,避免对基极—发射极施加过大反向电压。
  • 热管理:Pd=800 mW,长时间工作应注意封装散热与环境温度,必要时使用散热措施或改变工作点以降低耗散。
  • 静电与处理:按普通半导体器件的 ESD 防护规范处理与安装。

六、选型建议

若设计要求为低驱动电流下实现较大输出并且工作电压在 60 V 以下、功耗处于小功率范围内,2SD2719 是合适选择。反之若需高电流饱和导通或低 VCE(sat)、较大功耗能力,应选用低饱和或功率级三极管。最终选型请以完整数据手册的典型曲线与额定条件为准,并在目标工作点上做实际测量验证。

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