WMSIC Electronic Components

74VHC08FT(BJ) 74VHC08FT

Model74VHC08FT(BJ)
PackageTSSOP14B
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA 74VHC08FT(BJ)
Type
TOSHIBA
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
74VHC08FT(BJ)
Electronic Component
1
Package
TSSOP14B
Electronic Component
Logic Gate
Electronic Component
74VHC
Electronic Component
0.087g
Electronic Component
1
Channel Count
4
Electronic Component
BM0229354843
Operating Temperature
40℃~+125℃
Operating Voltage
2V~5.5V
Logic Type
and Gate
Current(IOH)
8mA
Current(IOL)
8mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

74VHC08FT(BJ) — 东芝 74VHC 系列 四路二输入与门 产品概述

一、产品简介

74VHC08FT(BJ) 是东芝(TOSHIBA)推出的一款高性能、低功耗的 74VHC 系列逻辑芯片,包含四个独立的二输入与门(quad 2-input AND gates)。该器件专为 2.0V 至 5.5V 的宽工作电压范围设计,适用于需要兼容多种电源电压、对速度与功耗有均衡要求的数字电路系统。封装形式为 TSSOP14B(14 引脚小型薄型封装),适合表面贴装(SMT)应用。

二、主要特性

  • 逻辑类型:与门(AND)
  • 通道数:4(每通道为二输入)
  • 输入数/通道:2
  • 工作电压(VCC):2.0V ~ 5.5V,适配低压与 5V 系统
  • 静态电流(Iq):典型 2 μA,便于电池供电与低功耗设计
  • 输出驱动能力:拉电流(IOH) / 灌电流(IOL) 均为 8 mA(典型)
  • 输入阈值:VIH = 1.5 V(输入被判定为高电平的最低电压,典型),VIL = 0.5 V(输入被判定为低电平的最高电压,典型)
  • 输出电平(在典型测试条件下):VOH = 4.4 V,VOL = 360 mV(在 5.0 V 工作电压下给出参考)
  • 传播延迟(tpd):约 7.9 ns(在 VCC = 5.0 V、负载 CL = 50 pF 时)
  • 工作温度范围:-40 ℃ ~ +125 ℃
  • 封装:TSSOP14B(小型薄型 14 引脚封装)
  • 系列:74VHC(低电压高速度 CMOS)

三、典型电气与时序特性说明

  1. 传播延迟(tpd):在 5.0 V、电容负载 50 pF 条件下,单级与门的典型传播延迟为 7.9 ns。实际延迟会随电源电压下降或负载电容增加而上升,因此在高频或较大扇出情况下需留有裕量。
  2. 输出电平(VOH/VOL):在标准条件下 VOH 可达到约 4.4 V(VCC = 5.0 V),VOL 可低至约 360 mV。输出驱动能力以 8 mA 为典型参考,适合驱动若干 TTL/CMOS 输入或小型负载。
  3. 阈值兼容性:VIH = 1.5 V、VIL = 0.5 V 表明在 3.3 V 与 5 V 系统间具备较好的互联兼容性,但在与其他逻辑家族(特别是较高阈值或较低阈值器件)互联时仍需确认实际输入阈值与噪声裕度。

四、应用场景

  • 嵌入式控制器与数字逻辑电路的逻辑组合与门
  • 低功耗便携式设备与电池供电系统(得益于 2 μA 级静态电流)
  • 多电压系统中的电平兼容逻辑桥接(2.0V~5.5V 宽电压)
  • 通用数字接口、地址解码、控制信号合成等场合

五、设计与使用建议

  • 去耦电容:建议在 VCC 与 GND 之间靠近器件引脚放置 0.1 μF 陶瓷去耦电容,以抑制瞬态电流和噪声。
  • 未用输入:不要让输入浮空,应将未使用输入固定至 VCC 或 GND 以避免功耗增加或不确定输出。
  • 扇出与驱动:每个输出典型驱动能力为 8 mA,因此在驱动多路负载或较大电容时需评估输出压降与时延。多个负载并联时应计算总输入电流与扇出限制。
  • 电平接口:若与 TTL、LVCMOS 等其他逻辑家族互联,检查在目标 VCC 下的 VIH/VIL 与对方输出 VOH/VOL 是否满足噪声裕度要求。
  • 温度与可靠性:器件工作温度范围宽(-40 ℃~+125 ℃),适用于工业级应用;在高温或高频工作条件下,静态电流和时序参数可能出现变化,应在系统级做验证。

六、封装与选型注意

TSSOP14B 封装提供较小的 PCB 占用面积,适合空间受限的板级设计。选型时注意器件标注(74VHC08FT(BJ))与生产批次、温度等级及 RoHS/合规性要求。如需外形尺寸、焊盘推荐或详细引脚排列,请参考东芝官方封装图与数据手册。

七、总结

74VHC08FT(BJ) 将 74VHC 系列的低压高速度特性与极低静态电流相结合,适合对功耗敏感且需要良好速度和电平兼容性的数字系统。通过合理的去耦、输入管理和负载评估,可在嵌入式、工业控制与各类逻辑电路中稳定发挥作用。有关更详细的电气特性、典型应用电路及 PCB 布局建议,请参阅东芝官方数据手册。

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