WMSIC Electronic Components

2SK3565(STA4,Q,M) 2SK3565

Model2SK3565(STA4,Q,M)
PackageSC-67
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA 2SK3565(STA4, Q, M)
Type
TOSHIBA
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
2SK3565(STA4,Q,M)
Electronic Component
1
Package
SC-67
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
2.54g
Electronic Component
1
Electronic Component
BM0257248182
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
45W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
900V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2SK3565 (STA4,Q,M) 产品概述

一、产品简介

2SK3565(STA4,Q,M)为东芝(TOSHIBA)出品的一款高压N沟道功率MOSFET,采用SC-67封装,适用于对耐压要求较高且电流不大的开关场合。器件额定漏源电压Vdss为900V,连续漏极电流Id为5A,耗散功率Pd为45W,适合高压开关与保护电路使用。

二、主要电气参数

  • 类型:N沟道场效应管(MOSFET)
  • 漏源电压 Vdss:900V
  • 连续漏极电流 Id:5A
  • 导通电阻 RDS(on):2.5Ω (Vgs=10V)
  • 阈值电压 Vgs(th):4V
  • 总栅极电荷 Qg:28nC(Vgs=10V)
  • 输入电容 Ciss:1.15nF(Vds=25V)
  • 输出电容 Coss:100pF
  • 反向传输电容 Crss:20pF(Vds=25V)
  • 耐温范围:-55℃ ~ +150℃
  • 封装:SC-67(小型表面贴装)

三、性能特点

  • 高耐压:900V额定耐压适合开关电源、初级侧开关及高压保护应用。
  • 能承受中等电流:5A的连续电流能力配合45W的耗散功率,可在有良好散热条件下工作。
  • 栅极驱动要求:Vgs(th)约4V,建议驱动电压采用10V以获得标称RDS(on),否则导通损耗显著增加。
  • 开关特性:Qg=28nC及Ciss=1.15nF表明开关过程中栅极驱动能量需求中等,需合适的驱动器以控制开关损耗和电磁干扰。Crss较小,有助于降低米勒效应带来的误触发。

四、典型应用场景

  • 离线开关电源(高压初级侧)
  • 反激/正激等功率转换拓扑的小功率开关元件
  • 工业电子的高压开关与保护电路
  • 高压脉冲发生器与缓冲电路

五、设计与使用建议

  • 驱动电路:为达到规格化的RDS(on),推荐栅极驱动电压10V,若采用逻辑电平驱动需验证导通电阻与损耗是否可接受。
  • 开关损耗管理:考虑Qg与Ciss较大时的开关损耗,采用快速栅极驱动器并调节驱动阻抗以平衡开关损耗与电磁干扰。
  • 热管理:在靠近45W的耗散能力下必须良好散热,评估封装的热阻并在电路板布局、散热片或铜箔面积上做相应设计与降额使用。
  • 抗浪涌与保护:高压应用中建议配合RC吸收、电流限制或软启动电路以防止过压、过流和单脉冲应力超限。
  • 焊接与可靠性:SC-67为小型贴片封装,遵循厂商推荐的回流焊温度曲线,避免过热导致性能下降。

六、封装与环境适应

SC-67小型封装利于表面贴装组装和紧凑布局。器件工作温度范围宽(-55℃至+150℃),适应工业级环境,但在高温或高负载场合需注意器件的热降额与长期可靠性评估。

总结:2SK3565(STA4,Q,M)是一款面向高压、低至中等电流应用的N沟MOSFET,适合要求900V耐压且对开关驱动与散热有明确设计的场合。在设计中应重点关注栅极驱动、开关损耗与热管理,以发挥其性能并确保长期可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.