WMSIC Electronic Components

TC7SZ08FE,LJ(CT TC7SZ08FE

ModelTC7SZ08FE,LJ(CT
PackageESV
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA TC7SZ08FE, LJ(CT
Type
TOSHIBA
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TC7SZ08FE,LJ(CT
Electronic Component
1
Package
ESV
Electronic Component
Logic Gate
Electronic Component
TC7SZ
Electronic Component
0.079g
Electronic Component
1
Channel Count
1
Features
Driver
Electronic Component
BM0264730013
Operating Temperature
40℃~+85℃
Operating Voltage
1.65V~5.5V
Logic Type
and Gate
Current(IOH)
32mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TC7SZ08FE,LJ(CT) 产品概述

一、产品定位与核心身份

TC7SZ08FE,LJ(CT)是东芝(TOSHIBA)TC7SZ系列的单通道2输入与门逻辑器件,属于超小型、低功耗、高速的基础逻辑单元。该器件专为需要紧凑设计、低能耗及宽电压兼容的电子系统打造,是消费电子、物联网终端、工业控制等领域的通用逻辑组件,可替代传统体积更大、功耗更高的逻辑器件。

二、核心电气参数解析

该器件的关键电气参数直接决定其适用场景,核心参数如下:

  1. 宽电压工作范围:支持1.65V~5.5V电压输入,覆盖从低功耗便携设备的1.8V/3.3V,到传统5V系统的全场景,无需额外电平转换电路,兼容性极强;
  2. 极低静态功耗:典型静态电流(Iq)仅2μA,远低于普通逻辑器件(通常数十μA级别),可显著延长电池供电设备的待机时间,适合无线传感器、可穿戴设备等低功耗场景;
  3. 高驱动能力:灌电流(IOL)和拉电流(IOH)均达32mA,可直接驱动小型负载(如LED指示灯、微型继电器线圈、小型三极管基极等),无需额外驱动电路,简化系统设计;
  4. 高速传播延迟:在5.0V供电、50pF负载条件下,传播延迟(tpd)仅2.4ns,满足高频信号处理需求,适合数据总线、时钟同步等高速逻辑场景;
  5. 通道配置:2输入、1输出单通道设计,结构简单灵活,可根据系统需求级联或组合使用(如多个与门串联实现多输入逻辑)。

三、封装与物理特性

TC7SZ08FE,LJ(CT)采用东芝定制的ESV封装,属于超小型表面贴装封装(SOT-23-5类小型化封装),特点包括:

  • 尺寸紧凑:封装体积约1.6mm×1.0mm×0.8mm,节省PCB布局空间,适合高密度集成设计(如智能手机主板、智能手环等小型设备);
  • 表面贴装兼容:引脚间距0.95mm,适配自动化贴装工艺,生产效率高,适合批量制造;
  • 引脚定义清晰:5引脚设计(2输入、1输出、VCC、GND),布线简单,降低设计复杂度,新手也能快速上手。

四、性能优势与典型应用

基于上述参数,该器件具备明显的性能优势,覆盖多类应用场景:

1. 核心优势

  • 低功耗+宽电压平衡:既满足便携设备的低能耗需求,又兼容多系统的电压差异,无需额外电源管理组件;
  • 高速+高驱动协同:在保证信号传输速度的同时,可直接驱动负载,减少系统级联损耗,提升响应速度;
  • 小型化适配趋势:ESV封装完美契合当前电子设备“小、轻、薄”的设计趋势,适合手持、可穿戴等空间受限场景。

2. 典型应用

  • 消费电子:智能手机/平板的按键逻辑控制、遥控器的信号编码、智能玩具的功能逻辑运算;
  • 物联网终端:无线传感器节点的信号逻辑判断、智能家居设备的状态检测(如门窗传感器的触发逻辑);
  • 工业控制:小型PLC的输入输出逻辑处理、工业传感器的信号滤波(如温度传感器的阈值判断);
  • 可穿戴设备:智能手环/手表的功能逻辑切换、低功耗健康监测设备的信号控制(如心率异常报警逻辑)。

五、环境适应性与可靠性

该器件支持**-40℃~+85℃**的工作温度范围,属于工业级温度标准,可适应户外环境(如智能农业传感器)、车载辅助设备等高低温场景;同时,东芝的成熟工艺保证了器件在长期使用中的稳定性(失效率低于10 FIT),适合对可靠性要求较高的应用。

综上,TC7SZ08FE,LJ(CT)凭借“低功耗、宽电压、高速、小型化”的核心优势,成为各类电子系统中基础逻辑运算的优选组件,可有效简化设计、降低成本并提升产品竞争力。

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