WMSIC Electronic Components

74VHC132FT(BJ) 74VHC132FT

Model74VHC132FT(BJ)
PackageTSSOP-14B
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA 74VHC132FT(BJ)
Type
TOSHIBA
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
74VHC132FT(BJ)
Electronic Component
1
Package
TSSOP-14B
Electronic Component
Logic Gate
Electronic Component
74VHC
Electronic Component
0.121g
Electronic Component
1
Channel Count
4
Electronic Component
BM0257300637
Operating Temperature
40℃~+125℃
Operating Voltage
2V~5.5V
Logic Type
and Gate
Current(IOH)
8mA
Current(IOL)
8mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

74VHC132FT(BJ) 产品概述

一、产品简介

74VHC132FT(BJ) 是东芝(TOSHIBA)推出的汽车级 CMOS 四路二输入与非门(NAND)逻辑器件,满足 AEC‑Q100 汽车可靠性规范。器件属于 74VHC 系列,结合了高速度与低功耗特性,工作电源电压范围宽(2.0V~5.5V),适用于车载和工业级电子系统中的通用逻辑处理与门控功能。

二、主要参数

  • 逻辑类型:与非门(NAND),每通道 2 输入,共 4 通道
  • 工作电压:2.0 V ~ 5.5 V
  • 静态电流(Iq):典型 2 μA(低静态功耗)
  • 输出电流:拉电流 IOL = 8 mA,灌电流 IOH = 8 mA
  • 输出低电平(典型):VOL ≈ 360 mV
  • 传播延迟:tpd ≈ 7.7 ns(VCC = 5 V,CL = 15 pF)
  • 工作温度范围:-40 ℃ ~ +125 ℃
  • 封装:14 引脚 TSSOP‑B(TSSOP‑14)
  • 质量等级:符合 AEC‑Q100(汽车级)

三、关键特性与优势

  • 汽车级可靠性:AEC‑Q100 认证保证在严苛环境下的稳定性与寿命,适合车载电子系统。
  • 宽电源范围:2.0V~5.5V 使其在 3.3V 与 5V 系统间灵活使用,也可用于低压微控制器接口。
  • 低静态功耗:典型静态电流仅 2 μA,有利于待机及低功耗系统设计。
  • 良好驱动能力:IOH/IOL 均为 8 mA,可直接驱动若干中小负载或下一级 CMOS 输入。
  • 快速响应:在 5 V、15 pF 负载条件下 tpd 约 7.7 ns,适合中高速逻辑应用。

四、典型应用场景

  • 汽车电子控制单元(ECU)中的逻辑控制与信号整形
  • 车载通信接口、传感器信号预处理和开关逻辑
  • 工业控制与仪表中对可靠性与温度范围有高要求的逻辑段
  • 通用数字电路、门阵列与电平转换前端(注意电平匹配)

五、封装与机械注意事项

器件以 TSSOP‑14B 小外形封装提供,适合表面贴装工艺(SMT)。在 PCB 设计与生产时应注意焊盘尺寸、热回流曲线与湿度防护要求;汽车级器件在长时间高温作业下需按厂家推荐的工艺与可靠性流程处理。

六、设计与使用建议

  • 电源去耦:在器件 VCC 引脚附近放置 0.1 μF 陶瓷去耦电容,以抑制瞬态噪声,保证传播延迟与输出完整性。
  • 负载与驱动:虽具有 8 mA 的输出能力,但若驱动较大容性负载或长线,需考虑延时和电平摆率,必要时加入缓冲器或限流措施。
  • 温度与裕度:在高温或极端工况下关注电平裕度与静态电流变化,进行充分的边界条件测试。
  • 接口匹配:在与不同电压域器件互联时确认逻辑电平兼容性,必要时采用电平移位或隔离方案。

以上为 74VHC132FT(BJ) 的概述与实用建议,适合在车载与工业场景中作为可靠的四路二输入 NAND 基本逻辑单元。若需引脚图、详细电气特性曲线或典型应用电路,请告知,我可提供更详尽的资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.