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1SV281(TPH3,F) 1SV281
Configuration
1 options
Configuration
23+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TOSHIBA 1SV281(TPH3, F)
- Type
- TOSHIBA
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TOSHIBA
- Electronic Component
- 1SV281(TPH3,F)
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Varactor Diode
- Electronic Component
- 0.022g
- Capacitor
- 2@C1V/C4V
- Electronic Component
- 1
- Electronic Component
- BM0227645894
- Diode
- Electronic Component
- Resistor(Rs)
- 280mΩ
- Current(Ir)
- 3nA@10V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SV281 (TPH3,F) 产品概述
一 产品简介
1SV281（TPH3,F）是东芝（TOSHIBA）推出的一款独立式变容二极管（Varactor）。该器件以小型封装、低漏电与稳定电容特性为主要卖点，适用于需要电容随反向偏压精确变化的射频调谐与频率合成电路。
二 主要规格
- 类型：独立式变容二极管
- 电容：CT = 8.7 pF（在 VR = 4 V，f = 1 MHz 条件下）
- 电容比：2（C@1V / C@4V = 2）
- 串联电阻 Rs：280 mΩ
- 直流反向耐压 VR：10 V
- 反向漏电流 Ir：3 nA（@ 10 V）
- 封装：SOD-523（超小型贴片）
- 品牌：TOSHIBA（东芝）
三 典型应用
- 无线电调谐电路（VCO、PLL）
- FM/AM 前端可变谐振电路与天线调谐
- 频率合成器与本振（LO）微调
- 自动频率控制（AFC）与可变滤波器电路
四 特点与优势
- 小巧封装（SOD-523），便于高密度贴装与便携设备集成。
- 在 4 V 时电容约 8.7 pF，1–4 V 区间电容变化明显（电容比约 2），利于宽范围调谐。
- 低漏电（3 nA@10 V）有利于维持偏压稳定，提升调谐线性与相位噪声性能。
- 低等效串联电阻（Rs = 280 mΩ）有助于保持较高 Q 值，降低损耗。
五 电路及使用建议
- 变容二极管工作在反向偏压区，调谐电压通过偏置网络施加（常用偏置电阻、大阻值或偏置电感隔离 RF）。
- RF 信号常通过耦合电容与变容二极管并联形成可调谐谐振回路；注意使用直流隔离电容以防破坏偏压。
- 测量电容值通常以 1 MHz 条件为基准，高频（GHz）条件下器件的等效电容与损耗会有变化，应以实际频段测试为准。
- 建议在偏压接近最大 VR（10 V）时注意漏电与击穿裕量，不要超出额定反向耐压。
六 封装与可靠性
SOD-523 为超小型贴片封装，适合自动贴装与回流焊工艺。由于体积小，焊接与回流工艺需遵照东芝推荐的温度曲线并注意防潮处理（MBB）。同时应注意静电防护（ESD），在生产与装配过程中采取合适接地与离子吹扫措施。
七 选型要点与注意事项
- 若需要更宽的调谐范围或更高电容比，请确认 C(V) 曲线是否满足系统线性与范围要求。
- 在高频应用（上百 MHz 以上）需验证实际 Q 值与寄生参数对电路性能的影响。
- 小封装带来热与功耗限制，适用于小信号调谐场合，避免在高功率路径上直接承载大电流。
总结：1SV281 以其稳定的电容特性、低漏电与微小封装，适合移动通信、消费类无线设备与精密频率合成电路中的调谐元件选择。实际设计时建议结合目标频段与调谐范围做专门评估与样机测试。
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