WMSIC Electronic Components

CMS30I40A(TE12L,QM CMS30I40A

ModelCMS30I40A(TE12L,QM
PackageSOD-128
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TOSHIBA CMS30I40A(TE12L, QM
Type
TOSHIBA
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
CMS30I40A(TE12L,QM
Electronic Component
1
Package
SOD-128
Electronic Component
Schottky Diode
Electronic Component
1g
Electronic Component
1
Electronic Component
BM0258630287
Current
3A
Diode
1
Current(Ir)
100uA@40V
(Vf)
550mV@3A
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CMS30I40A (TE12L, QM) 产品概述

一、概述与型号定位

CMS30I40A 为东芝(TOSHIBA)推出的一款肖特基整流二极管,额定反向耐压为 40V,连续整流电流 3A,封装为 SOD-128(M‑FLAT 细间距表贴型)。该器件以低正向压降与快速恢复特性为主,适用于要求高效率、低功耗的开关电源及整流场合。型号后缀 TE12L、QM 可能为内部封装/质量等级或出货批次标识,选型时请以东芝正式数据手册为准。

二、主要电气参数

  • 正向压降 (Vf):典型 0.55 V @ IF = 3 A(用于估算导通损耗)
  • 直流反向耐压 (Vr):40 V(最大反向电压)
  • 连续整流电流:3 A(在适当散热条件下的额定电流)
  • 反向电流 (Ir):100 μA @ VR = 40 V(环境温度升高时漏电流会显著增加)
  • 开关特性:肖特基二极管反向恢复时间很短,适合高速开关场合

注:在 3 A 工作时的导通功耗约为 P = Vf × IF ≈ 1.65 W,热管理设计需根据实际散热条件进行热阻和结温计算。

三、封装与热管理

CMS30I40A 采用 SOD‑128(M‑FLAT)表面贴装封装,适合自动化贴装与回流焊工艺。该封装体积小,但热阻相对较高,因此在高电流应用下需注意 PCB 散热设计:

  • 推荐在焊盘下方及附近布置较大铜箔散热区,必要时在焊盘周围打通散热过孔(thermal vias)连接到内层或底层铜箔。
  • 评价结温时应考虑环境温度、铜箔面积以及器件与 PCB 的热阻。
  • 在 3A 连续工作条件下,应按数据手册的结‑环境热阻与结‑焊盘热阻进行额定电流的热仿真或实测,确保结温低于允许最大值。

四、典型应用场景

  • 开关电源输出整流、低压降整流器
  • DC‑DC 转换器、降压/升压模块二级整流
  • 反向电流/反极性保护电路
  • 电池充放电路径、便携式设备电源管理
  • 电信与网通设备的低压整流(在 40V 额定内)
    提示:若用于含有高瞬态浪涌或需更高反向耐压的系统,应选择更高 Vr 或增加抑制元件。

五、设计与使用建议

  • 布局:缩短二极管与开关器件之间的回路长度,减小寄生电感;输出侧靠近负载放置以降低环路损耗。
  • 旁路:输出侧并联足够的旁路电容以平滑电压并分担瞬态电流。
  • 热设计:为保证长期可靠性,按最大环境温度进行热裕度设计,必要时加装散热铜箔或散热片。
  • 反向漏流:注意高温下反向漏电流增加,影响待机功耗与热预算。
  • 焊接:遵循东芝规定的回流焊曲线与焊接工艺参数,避免超温导致封装或内部应力损伤。
  • 测试验证:建议在目标应用环境下做热冲击、长时间老化与浪涌电流测试,验证实际性能与寿命。

六、可靠性与资料获取

东芝为该型号提供完整的数据手册与可靠性说明(包括最大额定值、瞬态特性、热阻和回流焊曲线)。在工程选型与生产导入前,请参考东芝官方 Datasheet、器件出货标识(TE12L、QM 等)及必要的认证资料,确保满足系统规范与安规要求。若有特殊应用场景(如汽车或高温工况),建议与供应商或东芝技术支持确认合适性与额外认证需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.