WMSIC Electronic Components

TC7SHU04FU,LJ(CT TC7SHU04FU

ModelTC7SHU04FU,LJ(CT
PackageSSOP-5
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA TC7SHU04FU, LJ(CT
Type
TOSHIBA
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TC7SHU04FU,LJ(CT
Electronic Component
1
Package
SSOP-5
Electronic Component
Inverter
Electronic Component
TC7SHU
Electronic Component
0.038g
Electronic Component
1
Electronic Component
1
Channel Count
1
Electronic Component
BM0265872435
Operating Temperature
40℃~+85℃
Operating Voltage
2V~5.5V
Current(IOH)
8mA
Current(IOL)
8mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TC7SHU04FU,LJ(CT) 产品概述

一、产品基本定位

TC7SHU04FU,LJ(CT)是东芝(TOSHIBA)推出的TC7SHU系列单通道反相器,核心功能为实现输入逻辑电平的反相输出(输入高→输出低,输入低→输出高)。该器件以「超小型封装、极低静态功耗、宽电压兼容」为核心优势,适配便携设备、物联网节点、工业控制等多场景的逻辑信号处理需求,是高密度PCB设计中电平转换的理想选择。

二、核心电气参数解析

关键参数直接决定应用边界,具体解析如下:

1. 电源与功耗参数

  • 工作电压范围:2V~5.5V,覆盖主流低压(2V)、标准低压(3.3V)及传统5V电源系统,无需额外电平转换电路即可兼容不同供电平台;
  • 静态电流(Iq):仅2μA,属于行业低功耗水平,持续待机状态下可将系统功耗降至最低,尤其适合电池供电的便携设备(如可穿戴、物联网节点)。

2. 逻辑与驱动参数

  • 通道结构:1通道单输入/单输出,电路设计简单,易于集成;
  • 驱动能力:灌电流(IOL)、拉电流(IOH)各8mA,足够带载小型负载(如LED指示灯、小信号放大电路),无需额外驱动级;
  • 逻辑电平阈值:输入高电平(VIH)≥1.7V,输入低电平(VIL)≤300mV,兼容TTL/CMOS逻辑电平,可直接对接多数MCU、传感器输出;
  • 传播延迟:7ns(@5V/50pF负载),高速响应满足高频逻辑切换需求(如时钟信号反相、脉冲整形)。

3. 环境适应性参数

  • 工作温度范围:-40℃~+85℃,覆盖工业级温度区间,可适应户外、车载、工业控制等恶劣环境的长期稳定工作。

三、关键性能优势

基于参数特性,该器件具备以下核心优势:

  1. 低功耗设计:2μA静态电流大幅延长电池续航,例如纽扣电池供电的传感器节点,续航可从数月提升至数年;
  2. 宽电压兼容:无需针对不同电源调整电路,简化设计流程,降低BOM成本;
  3. 高速响应:7ns传播延迟确保逻辑信号无明显失真,适合高频小信号处理;
  4. 紧凑封装:USV超小型表面贴装封装,尺寸远小于传统DIP,适配高密度PCB(如智能手机主板、小型传感器模块);
  5. 高可靠性:工业级温度范围+成熟CMOS工艺,长期工作稳定性高,故障率低。

四、典型应用场景

该器件特性使其在多领域广泛应用:

  • 便携电子:智能手机、智能手环/手表的电平转换(3.3V MCU与5V外设对接);
  • 物联网节点:传感器模块信号反相(如温度传感器输出与MCU电平匹配),低功耗适配电池供电;
  • 工业控制:小型PLC逻辑运算、现场传感器信号调理;
  • 消费电子:遥控器、智能插座的信号处理;
  • 车载辅助:车载USB接口、小型显示屏的电平转换(适配12V转5V电源)。

五、封装与可靠性说明

采用USV超小型表面贴装封装,符合RoHS环保标准,支持回流焊工艺,焊接可靠性高。封装尺寸紧凑(具体参考东芝官方 datasheet),可有效节省PCB空间,适合高密度集成。此外,器件通过温度循环、湿度老化等可靠性测试,确保极端环境下稳定工作。

该器件平衡了功耗、速度与集成度,是小信号逻辑处理场景的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.