WMSIC Electronic Components

TPN2R203NC,L1Q(M TPN2R203NC

ModelTPN2R203NC,L1Q(M
PackageTSON-8(3.1x3.1)
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TOSHIBA TPN2R203NC, L1Q(M
Type
TOSHIBA
Unit
Electronic Component
Minimum package
5000

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TPN2R203NC,L1Q(M
Electronic Component
1
Package
TSON-8(3.1x3.1)
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.143g
Electronic Component
1
Electronic Component
BM0231133068
Power Dissipation(Pd)
42W
Electronic Component
5000
Voltage(Vdss)
30V
Capacitor(Ciss)
2.23nF
Output Capacitor(Coss)
650pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TPN2R203NC,L1Q(M) 产品概述

一、产品简介

TPN2R203NC,L1Q(M) 是东芝(TOSHIBA)出品的一款高性能N沟道功率MOSFET,适用于中低压、大电流开关场合。器件额定漏源电压为30V,连续漏极电流可达45A,结合低导通电阻与适度的栅极电荷,使其在开关和低损耗传导应用中表现优秀。封装采用紧凑的TSON-8 (3.1 × 3.1 mm),适合密集的电源模块与功率管理板设计。

二、主要电气参数

  • 漏源电压 Vdss:30V
  • 连续漏极电流 Id:45A
  • 导通电阻 RDS(on):2.2 mΩ @ Vgs=10V, 测试电流22.5A
  • 功耗 Pd:42W
  • 阈值电压 Vgs(th):2.3V
  • 总栅极电荷 Qg:34 nC @ Vgs=10V
  • 输入电容 Ciss:2.23 nF;输出电容 Coss:650 pF;反向传输电容 Crss:160 pF

三、核心特性与优势

  • 极低的RDS(on)(2.2 mΩ)在导通状态下显著降低导通损耗,提高转换效率,适合高电流路径。
  • 相对中等的Qg(34 nC)在驱动能力与开关损耗间取得平衡,便于使用常见驱动器或单片驱动方案。
  • 紧凑TSON-8封装有利于缩小系统尺寸,同时支持较好的热路径设计与PCB散热解决方案。

四、典型应用场景

  • 同步整流器与高效DC-DC降压转换器(Buck)
  • 负载开关与电源分配网络(PDN)
  • 车规与工业控制中低压大电流开关应用
  • 电源管理模块、服务器与通信设备的功率级

五、封装与热管理

TSON-8 (3.1 × 3.1 mm) 封装利于贴片自动化,但由于器件可承受高达42W耗散,建议在PCB上设计充分的铜箔散热垫和过孔散热通道,必要时配合散热片或底板散热。实际散热性能受PCB厚度、铜面积及通孔连接影响,应按应用场景进行热仿真并验证结温。

六、选型与使用建议

  • 若系统工作电压接近30V或存在浪涌,应考虑添加合适的浪涌保护与安全裕量。
  • 对驱动器选择:推荐能提供接近10V栅压的驱动,以获得标称RDS(on);若驱动电压受限,需评估RDS(on)随Vgs下降的影响。
  • 在高频开关应用中关注Qg与Coss带来的开关损耗,必要时优化死区时间与驱动强度以降低交叉导通。

七、注意事项与可靠性

在设计中需考虑开启/关断瞬态、电容充放电影响以及寄生电感导致的振铃;布局上应缩短栅、源回路长度以降低噪声和应力。出厂参数为典型/测试条件下测得,实际应用请参照完整数据手册并在目标板级环境中进行验证。

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