WMSIC Electronic Components

2SC4213-B(TE85L,F) 2SC4213

Model2SC4213-B(TE85L,F)
PackageSC-70
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA 2SC4213-B(TE85L, F)
Type
TOSHIBA
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
2SC4213-B(TE85L,F)
Electronic Component
1
Package
SC-70
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.014g
Electronic Component
1
Electronic Component
BM0232342064
Transistor Type
NPN
Frequency(f T)
30MHz
Power Dissipation(Pd)
100mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
300mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2SC4213-B (TE85L, F) 产品概述

一、主要参数

  • 晶体管类型:NPN 双极型晶体管(BJT)
  • 集电极电流 Ic:300 mA(最大)
  • 集射极击穿电压 Vceo:20 V
  • 最大耗散功率 Pd:100 mW
  • 直流电流增益 hFE:200(在 Ic=4 mA、VCE=2 V 条件下)
  • 特征频率 fT:30 MHz
  • 集电极截止电流 Icbo:100 nA
  • 集电极饱和电压 VCE(sat):约 100 mV(典型饱和条件)
  • 射基极击穿电压 Vebo:25 V
  • 品牌:TOSHIBA(东芝)
  • 封装:SC-70(小型表面贴装封装)

二、特性与性能分析

2SC4213-B 为低功耗、小体积的 NPN 小信号晶体管。高 hFE(在低电流工作点上可达 200)意味着在小基极电流下可获得较大的集电极电流放大,适合做驱动级或电流放大用途。fT≈30 MHz 表明其适用于音频及中低频放大或开关应用,但不适合高频 RF 放大(VHF 以上)。低 Icbo(100 nA)表示漏电流小,低噪声电路和电池供电设备更易保持静态电流低。

三、封装与热设计

SC-70 为超小型 SMD 封装,适合空间受限的便携设备与消费电子。需注意其 Pd 仅 100 mW,热容量有限。实际工作时应计算 VCE×Ic 不超过 Pd,并留有安全裕量。例如在饱和导通(VCE≈0.1 V)且 Ic 较小时,耗散较小;但若 VCE 为数伏、Ic 数十毫安时,耗散可能迅速超过额定值。建议在电路设计中避免长时间在高 VCE×Ic 条件下工作,必要时采用并联或更高功率器件。

四、典型应用

  • 小信号开关与驱动(例如驱动继电器前置级、LED 驱动)
  • 低功耗放大器(前置放大、音频前级)
  • 电池供电设备中的信号放大与开关控制
  • 消费类电子与便携仪器中的通用放大/切换元件

五、使用建议与注意事项

  • 利用其高 hFE,可在基极限流的情况下实现较小驱动电流,但在逼近饱和区时要给予足够基极电流以降低 VCE(sat)。
  • 设计时优先保证 Pd 安全:Pd ≥ VCE×Ic(含热阻与环境温度影响)并留裕量。
  • Vceo=20 V 与 Vebo=25 V 提醒不要在高电压脉冲或反向基极电压下超过极限,以防击穿。
  • SC-70 封装在回流焊接时需遵循厂商温度曲线与防静电措施,避免过热与 ESD 损伤。
  • 若在高频或高电流场合使用,应评估 hFE 的随电流衰减及 fT 限制,必要时采用补偿或更高规格器件。

总结:2SC4213-B 是一枚面向低功耗、小尺寸应用的 NPN 小信号晶体管,适合便携式与消费电子中的放大与开关场景。在设计中重点考虑其 100 mW 的耗散限制与 20 V 的电压极限,合理偏置与散热安排可发挥其高增益与低饱和压的优点。

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