WMSIC Electronic Components

1SS300,LF(T 1SS300

Model1SS300,LF(T
PackageSC-70(SOT-323)
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA 1SS300, LF(T
Type
TOSHIBA
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
1SS300,LF(T
Electronic Component
1
Package
SC-70(SOT-323)
Electronic Component
Switch Diode
Electronic Component
0g
Electronic Component
1
Electronic Component
Switch Diode
Electronic Component
BM0265124966
Current
100mA
Diode
1
Current(Ir)
500nA@80V
(Vf)
920mV@100mA
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SS300,LF(T)开关二极管产品概述

一、产品核心定位与应用场景

1SS300,LF(T)是东芝推出的1对串联式开关二极管,定位于小信号高速开关应用场景。作为开关二极管,其核心优势在于超高速反向恢复特性,可满足高频电路、高速逻辑系统对开关速度的严苛要求;串联式结构则优化了双向开关性能,适配更多电路拓扑。该产品广泛适用于便携式电子设备、射频电路、高速数字逻辑、信号保护等领域,是小信号开关电路的高性价比选择。

二、关键电气参数详解

1SS300,LF(T)的电气参数围绕“高速开关”和“低损耗”核心设计,关键参数及意义如下:

1. 反向恢复时间(trr):1.6ns

反向恢复时间是开关二极管从导通切换到截止的核心指标,1.6ns的超短trr意味着器件可在极短时间内完成开关切换,大幅降低高频应用中的开关损耗,避免信号失真,适合100MHz以上的高速电路(如射频前端、高速计数器)。

2. 反向漏电流(Ir):500nA @ 80V

反向漏电流反映器件截止状态下的漏电情况,500nA的极低漏电流可有效减少反向功耗,同时避免漏电流对敏感电路(如精密模拟电路、低功耗数字电路)的信号干扰,提升电路稳定性。

3. 正向压降(Vf):920mV @ 100mA

在额定正向电流100mA下,正向压降为920mV,处于小信号开关二极管的典型范围——既保证导通状态下的低损耗(避免过多功率消耗),又与超高速trr实现性能平衡(若追求更低Vf可能牺牲开关速度)。

4. 额定参数:100mA(整流电流)、80V(反向耐压)

  • 正向最大整流电流(IF)为100mA,满足绝大多数小信号电路的电流需求(如逻辑门驱动、信号传输);
  • 直流反向耐压(Vr)为80V,可覆盖一般电压等级的应用场景(如5V-48V系统),无需额外降额即可稳定工作。

5. 串联式配置:1对串联

采用1对二极管串联结构,可实现双向开关功能(避免单向二极管的反向截止局限),或通过串联提升整体反向耐压(单管耐压叠加),适配双向信号钳位、双向续流等电路拓扑。

三、封装与物理特性

1SS300,LF(T)采用SOT-323封装(表面贴装型),物理尺寸紧凑(典型尺寸:2.9mm×2.4mm×1.1mm),具有以下优势:

  • 小尺寸:适合高密度PCB设计,可大幅节省电路板空间,适配便携式设备(手机、智能手表)、小型电子模块(如传感器接口、射频模块);
  • 表面贴装:兼容自动化贴装生产线,提升量产效率,降低焊接难度;
  • 耐热性:符合工业级温度要求(通常-55℃~150℃工作温度范围),适应恶劣环境应用。

四、品牌与可靠性优势

作为东芝(TOSHIBA)旗下产品,1SS300,LF(T)继承了品牌的高可靠性优势:

  • 一致性:批量生产中参数一致性好,避免因器件差异导致的电路性能波动,适合大规模量产;
  • 环保合规:符合RoHS、REACH等国际环保标准,无有害物质(如铅、镉),适配绿色电子产品设计;
  • 可靠性验证:经过严格的可靠性测试(温度循环、湿度老化、机械应力测试),确保长期稳定工作(典型寿命可达数万小时)。

五、典型应用示例

结合1SS300,LF(T)的参数特性,其典型应用场景包括:

  1. 高速逻辑电路:FPGA、MCU的IO口信号开关、钳位保护,利用超短trr避免信号延迟;
  2. 射频前端电路:蓝牙、WiFi模块的信号路径切换,适配高频信号的快速开关需求;
  3. 便携式设备接口:手机USB接口、耳机接口的ESD保护,低漏电流不影响信号传输;
  4. 小信号电源电路:低功耗电源的整流、续流,100mA电流满足小功率需求;
  5. 双向信号处理:双向数据总线的开关控制,串联结构实现双向导通/截止。

综上,1SS300,LF(T)凭借超高速开关特性、低漏电流、紧凑封装及东芝品牌可靠性,成为小信号高速开关应用的理想选择。

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