WMSIC Electronic Components

2SK209-BL(TE85L,F) 2SK209

Model2SK209-BL(TE85L,F)
PackageSC-59
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA 2SK209-BL(TE85L, F)
Type
TOSHIBA
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
2SK209-BL(TE85L,F)
Electronic Component
1
Package
SC-59
Electronic Component
1 N
Electronic Component
MOSFET(JFET)
Electronic Component
0.019g
FETType
N
Electronic Component
1
Electronic Component
BM0228736742
Power Dissipation(Pd)
150mW
Electronic Component
Electronic Component
Electronic Component
3000
Current(Idss)
14mA
Capacitor(Ciss)
13pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2SK209-BL (TE85L,F) 产品概述

一、器件简介

2SK209-BL(TE85L,F)为东芝(TOSHIBA)生产的N沟结型场效应管(JFET),属小功率、小体积射极结型器件,适用于低噪声、小信号放大与缓冲。主要参数(典型/标称值):栅源截止电压 VGS(off) = 1.5V(测量电流 IG = 100nA);栅源击穿电压 Vgss = 50V;耗散功率 Pd = 150mW;漏源电流 Idss = 14mA(VDS = 10V);输入电容 Ciss = 13pF(VDS = 10V);封装为 SC-59(SMD 小型封装)。

注:上列 VGS(off) 给出为幅值形式,具体极性及典型分布请以原厂数据手册为准(N沟器件在电路中常以负栅压表示器件截止特性)。

二、主要特性

  • 高输入阻抗,栅极漏电流极小,适合作为缓冲级或前置放大器。
  • 低输入电容(Ciss ≈ 13pF),对高频响应影响小,适合宽带或射频前端的小信号处理。
  • 中等 Idss(≈14mA@10V),便于在低电压下获得数毫安电流工作点。
  • 耗散功率较低(150mW),适合低功耗、贴片安装的场合。
  • 50V 的栅源击穿保证在一般小信号电路中具有较好的耐压裕度。

三、典型应用场景

  • 低噪声前置放大(话筒、传感器前端)。
  • 电平缓冲、阻抗变换(源跟随器)。
  • 简单恒流源与偏置电路。
  • 模拟开关、混频器或小信号差分级。
  • 便携设备与空间受限的贴片电路。

四、偏置与设计要点

JFET 常用 Shockley 方程近似描述 Id 与 Vgs 的关系:Id = Idss × (1 − Vgs/Vp)^2,其中 Vp 即 VGS(off) 的幅值。实际设计时应注意 Idss 与 VGS(off) 的器件间变动,推荐采用自偏置(源极电阻)或带负反馈的偏置方式以提高稳定性。由于耗散功率仅 150mW,应在设计工作点时计算结温并留有足够余量,避免在高环境温度或无散热的情况下逼近功率极限。

五、封装、热管理与注意事项

SC-59 为小型 SMD 封装,适合表面贴装和回流焊工艺。该器件功耗有限,电路板布局应考虑引脚散热及铜箔面积以降低结温。JFET 对静电较敏感,焊接、测试与装配过程中应采取 ESD 防护措施(接地手环、防静电台垫、离子风机等)。

六、结语

2SK209-BL 适合用于要求低噪声、低输入电容和小功率的模拟前端与缓冲应用。具体电气特性曲线、极限值与封装机械尺寸请以东芝官方数据手册为准;在实际电路中推荐进行器件筛选与仿真以确定最佳偏置与稳定性。

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