WMSIC Electronic Components

74HC238D(BJ) 74HC238D

Model74HC238D(BJ)
PackageSOIC-16
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA 74HC238D(BJ)
Type
TOSHIBA
Minimum package
2500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
74HC238D(BJ)
Electronic Component
1
Package
SOIC-16
Electronic Component
Analog Switch / Multiplexer
Electronic Component
3.017g
Electronic Component
1
Channel Count
8
Features
ESD
Electronic Component
BM0228736739
Operating Temperature
40℃~+125℃
Operating Voltage
2V~6V
(tpd)
26ns
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

74HC238D(BJ) 产品概述

一、概述

TOSHIBA(东芝)74HC238D(BJ) 是一款基于 74HC CMOS 工艺的三-八译码/去码器,带闭锁/使能功能,提供 8 路输出通道(Y0–Y7)。器件工作电压范围宽(2V ~ 6V),适用于低压到常见 5V 系统,典型传播延迟(tpd)约 26 ns,工作温度范围 -40℃ ~ +125℃,常见封装为 SOIC-16,适合中高密度 PCB 应用。

二、主要参数

  • 通道数:8 路输出
  • 工作电压:2 V ~ 6 V(宽电源范围,兼容低压系统)
  • 工作温度:-40℃ ~ +125℃
  • 传播延迟(tpd):约 26 ns(典型值,视 VCC 与负载而变)
  • 封装:SOIC-16(D)
  • 品牌:TOSHIBA(东芝)
  • 特性:CMOS 低功耗、逻辑闭锁/使能输入以实现输出片选或锁定功能

三、功能描述

74HC238D 提供三位二进制地址输入(A、B、C)并将其译码为八路输出。器件带有闭锁/使能输入(可用于片选或输出禁能),常用于将单组地址或控制信号扩展为多个选通信号。输出通常为低电平有效(Y 输出在选中时置低),但具体极性和使能逻辑请以器件数据手册为准。

四、典型应用

  • 存储器/外设地址译码与片选(Address decoding)
  • 多路解复用(Demultiplexing)与信号分配
  • 数字系统的片选、总线分时控制
  • LED 显示或驱动(请在输出与 LED 之间加限流电阻)
  • 小型规则化逻辑扩展与地址分配电路

五、设计与使用要点

  • 电源滤波:在 VCC 与 GND 之间靠近器件放置 0.1 µF 陶瓷去耦电容,抑制瞬态噪声,改善传播延迟与稳定性。
  • 未使用输入:所有地址与使能输入不得悬空,应拉到定义的有效电平(通过上拉或下拉电阻)以避免功耗上升或不稳定输出。
  • 输出驱动与负载:74HC 系列为 CMOS 输出,驱动能力有限,直接驱动大电流负载(如大功率 LED、电机)需外加驱动器或晶体管。对高速切换输出建议串联小阻以抑制振铃与 EMI。
  • 时序考虑:典型 tpd ≈ 26 ns,若在高速系统中做级联译码,需留出足够的建立/保持时间与传播延迟余量。
  • 热与可靠性:SOIC-16 封装适合常规 SMT 工艺,PCB 布局时注意散热通路与焊盘设计,保证器件在 -40℃ 至 +125℃ 范围内稳定工作。

六、封装与可靠性建议

74HC238D(BJ) 的 SOIC-16 封装便于 SMT 组装与批量生产。选择时请确认东芝原厂或授权分销渠道,核对封装代码(D)与后缀(BJ)以保证器件的一致性与追溯性。量产设计中建议参考东芝官方数据手册获取完整的引脚定义、电气特性曲线及最大额定值,以确保在目标工作条件下长期可靠运行。

如需更详细的引脚图、真值表或完整电气参数(例如输入电流、输出电流、功耗随电压的典型曲线),建议查阅 TOSHIBA 官方数据手册或提供器件完整型号以便获取精确资料。

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